3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
From 2 Gb to 8 Gb, our Radiation Tolerant DDR SDRAM stacks enable high-density and high-speed (up to 400 MT/s). Powered by 2.5 V, the memories feature a wide range of data bus widths: x16b, x32b or x72b, making them the highest density density and fastest space qualified DDR1 on space market. They are offered in compact SOP or BGA package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
First released in 2009, 3D PLUS SDRAM products are used as fast processor RAM in a variety of high performance computer boards, and as high density storage memory in Solid State Data Recorder boards. They are used in diverse fields of space applications such as science and deep space missions, etc. These memory modules have been used on missions such as Formosat-5, SWOT, Exomars 2022 and others.
Highest density – smallest footprint (more than 85 % space savings in the design)
Wide data bus up to x72.
High speed up to 400 MT/s
TID > 50 krad(Si)
SEL LETth > 80 MeV.cm²/mg
SEU LETth : 0.7 MeV.cm²/mg ;
σsat = 1E-9 cm²/bit
SEFI LETth : 0.7 MeV.cm²/mg ;
σsat = 5.6E-4 cm²/device
Space quality level.
No pure tin guarantee (less than 97% tin guarantee)
Very long life time electronics (technology proven for 15 to 18 years missions in space)
Worldwide delivery guarantee
Our DDR1 are not recommended for new design.
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
Proving out the landing technology and study lunar samples