DDR4 SDRAM
Overview
3D PLUS offers a space-qualified DDR4 solution that is unmatched in terms of overall performance and radiation reliability. Similar to the DDR3 memories, our DDR4s feature an optimized design with decoupling capacitors and termination resistors embedded in the module. In regards to electrical performances, a step forward has been made. The DDR4s feature higher density (up to 6 GB), faster bandwidth (up to 2400 MT/s) and lower power consumption (1.2 V power supply).
All 3D PLUS DDR4 memories operate synergistically in an Ecosystem with two additional elements:
• A Radiation Intelligent Memory Controller (RIMC) ; https://www.3d-plus.com/product.php?fam=11&prod=32 3DIPMC0815-1, which achieves a global radiation hardened DDR4 solution. The RIMC IP core provides Single Event Upset (SEU) and Single Event Functional Interrupt (SEFI) mitigation. This allows reliable operation in radiation-prone environments.
• A radiation hardened by design Termination Regulator : https://www.3d-plus.com/product.php?fam=5&prod=42 3DPM0424-1. This companion chip provides all power requirements for DDR4 VTT bus designs. It reduces power dissipation while improving data transmission accuracy.
Radiation Performances
stand alone DDR4:
- TID > 100 krad(Si)
- SEL LET Threshold > 62.8 MeV.cm²/mg
- SEU LET Threshold: 2.6 MeV.cm²/mg, Saturated Cross Section = 4.00E-12 cm²/bit
- SEFI LET Threshold: 2.6 MeV.cm²/mg, Saturated Cross Section = 5.00E-5 cm²/device
DDR4 memory with RIMC DDR4:
- TID > 100 krad(Si)
- SEL LET Threshold > 62.8 MeV.cm²/mg
- SEU/SERE/SECE/SEFI mitigation with 3DIPMC0815
Key Benefits
• Long lifecycle products with proven reliability in Space
• Ruggedized, fully validated complete DDR4 solution
• Significant board area savings
• Optimized development time and cost
Lineup
Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
---|---|---|---|---|---|---|
3D4D48G48LB2825 | 1G x 48 | 1.2 V | 1.2 GHz | BGA 259 | C, I, S | 3DPA-8246 |
Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
---|---|---|---|---|---|---|
3D4D32G72LB2805 | 512M x 72 | 1.2 V | 1.2 GHz | BGA 259 | C, I, S | 3DPA-8260 |
Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
---|---|---|---|---|---|---|
3D4D24G48LB2833 | 512M x 48 | 1.2 V | 1.2 GHz | BGA 259 | C, I, S | 3DPA-8256 |
Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
---|---|---|---|---|---|---|
3D4D16G72LB2832 | 256M x 72 | 1.2 V | 1.2 GHz | BGA 259 | C, I, S | 3DPA-8252 |
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Rugged components able to withstand harsh environments and space radiation effects
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Over 20 years of flight heritage and 190,000 modules in Space