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DDR4 SDRAM

Overview

3D PLUS is launching on the market compact DDR4 modules for applications requiring high-speed computing memory.
Thanks to 3D PLUS proven stacking technology, DDR4 ruggedized modules offer high reliability in BGA packages for harsh environments.

Key Features

  • Density up to 32 Gbit
  • Bus width: 32 and 72 bits
  • Voltage: 1.2V
  • Data transfer: 2400 Mbps
  • Termination included
  • Available in Industrial and Military temperature range
  • Compact BGA packages
  • Long term supply continuity

Lineup

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVNESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 16 years of flight heritage and 100 000 modules in Space