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DDR4 SDRAM
Overview
3D PLUS is launching on the market compact DDR4 modules for applications requiring high-speed computing memory.
Thanks to 3D PLUS proven stacking technology, DDR4 ruggedized modules offer high reliability in BGA packages for harsh environments.
Key Features
- Density up to 64 Gbit
- Bus width: 72 bits
- Voltage: 1.2V
- Data transfer: 2400 Mbps
- Termination included
- Available in Industrial and Military temperature range
- Compact BGA packages
- Long term supply continuity
Lineup
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3D4D32G72LB2758 | 512M x 64b + 8b ECC | 1.2 V | 1200 MHz | BGA 267 | I, S, M | 3DFP-0758 |
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3D4D64G72LB2809 | 1024M x 64b + 8b ECC | 1.2 V | 1200 MHz | BGA 267 | I,S,M | 3DDS-0809 |
INNOVATION
Inventor of 3D stacked Electronics for Space
QUALITY
High Quality referential with ISO and Space Agencies Certifications
RESPONSIVENESS
Our support teams are everywhere you are to ensure your satisfaction
HIGH RELIABILITY
Rugged components able to withstand harsh environments and space radiation effects
HIGH PERFORMANCE PRODUCTS
Dense, fast, rad hardened, System in Packages, miniaturized
FLIGHT PROVEN
Over 20 years of flight heritage and 190,000 modules in Space