3D PLUS is launching on the market compact DDR4 modules for applications requiring high-speed computing memory.
Thanks to 3D PLUS proven stacking technology, DDR4 ruggedized modules offer high reliability in BGA packages for harsh environments.
- Density up to 32 Gbit
- Bus width: 32 and 72 bits
- Voltage: 1.2V
- Data transfer: 2400 Mbps
- Termination included
- Available in Industrial and Military temperature range
- Compact BGA packages
- Long term supply continuity
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 20 years of flight heritage and 190,000 modules in Space