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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
MNEMOSYNE is a project funded by the European Union as part of its policy to ensure its independence in space. The project, which started in 2019, is being carried out by a consortium led by 3D PLUS. In summer 2022, the test vehicle, a 64 Mbit ASIC, was received and tested as part of the project. Following the test results, it was decided to continue with the final ASIC with a density of 128 Mbit.
• TID > 100 krad(Si). • SEL, SEU, SET & SEFI LETh > 60 MeV.cm²/mg.
Using its stacking technology, 3D PLUS offers modules based on this SEE immune memory ASIC. • The 3DMN128M08US1852 features a 3.3 V parallel EEPROM interface. • The 3DMN512M08US4853 and 3DMN1G08US8854 feature a 1.8 V SPI interface.
The serial interface, single 1.8 V voltage supply, density, radiation performances, endurance, data retention and qualification position this memory module as the best-in class configuration/boot memory. It is therefore perfectly suited to the latest space FPGAs and processors featuring low-voltage I/O banks.
The first prototypes will be available by Q2 2024.
