EN FR
3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
The 3DCO0849 COMBO, developed by 3D PLUS, is an innovative COnfiguration Memory Boot Manager designed to configure and scrub high-end SRAM-based FPGAs and MPSoCs. This cutting-edge module is ideal for applications requiring extensive configuration memory, making it a top choice for space missions.
The 3DCO0849 COMBO module offers a unique solution by integrating all necessary hardware resources into a single module. This allows for the booting of SRAM-based FPGAs within the smallest PCB footprint available. The compact design is important for space applications where minimizing size and weight is essential.
The 3DCO0849 COMBO is compatible with AMD Versal™. This compatibility ensures seamless integration into various space systems, enhancing its versatility and utility.