3D PLUS High-Density 4Tbit and 8Tbit NAND Flash: Designed for Next-Generation Space Missions

As satellite constellations and New Space platforms demand ever-increasing data storage and processing capabilities, 3D PLUS introduces its latest 4Tbit and 8Tbit NAND flash memory modules in 215-ball BGA package. Designed for space-grade reliability, these modules combine large density, radiation tolerance, and robust endurance, making them ideal for mission-critical data storage in harsh environments.

Here we explore the technical specifications, performance advantages, and integration considerations of these new NAND Flash solutions, tailored for aerospace designers and system architects.

Technical Specifications & Performances

1. Memory Architecture and Endurance

• Built on Triple-Level Cell (TLC) NAND technology, operated in programmed Single-Level Cell (p-SLC) mode.
• Endurance of up to 60,000 program/erase cycles, ensuring reliability for long-duration missions.
• Strong data retention across wide temperature ranges and radiation environments.

These make the memory modules ideal for Earth observation satellites, deep-space probes, and high-write applications such as telemetry storage and onboard data logging.

2. Radiation Hardness

To meet the demands of space environments, the modules are:

• Qualified in compliance with  ESCC space-grade standards.
• Total Ionizing Dose (TID) tolerance > 25 krad for protection against cumulative radiation.
• Single Event Latchup (SEL) immunity with LET > 62.5 MeV·cm²/mg, preventing latch-up events under heavy-ions.

3. High-Speed Interface

The NAND Flash features:

• ONFI 4.2 NV-DDR3, supporting data transfer rates up to 600 MHz, enabling rapid read/write operations for high-throughput applications.
• Enables fast, low-latency access for real-time processing and high-throughput payloads.

4. Mechanical and Thermal performances

• 215-ball BGA package for compact system integration.
• Wide operating temperature range, suited for both LEO constellations and deep-space missions.

5. Availability:

• Engineering Models (EM): Available December 2025 for prototype testing and system validation.
• Flight Models (FM): Scheduled for June 2026, ready for full-scale deployment.