EN FR
3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS is the world's foremost provider of high-density 3D electronic products, specializing in cutting-edge stacking technology for bare chips and components. Our solutions are designed to meet the critical demands for high reliability, superior performance, and compact size in modern electronics.
Our innovative 3D technology involves the vertical stacking of electronic devices along the Z-axis. This process begins with the horizontal placement of electronic devices on a layer, where they are internally connected. These layers are then stacked vertically using advanced vertical interconnection techniques, optimizing space and enhancing functionality.
3D PLUS offers a comprehensive portfolio of patented stacking technologies, ranging from standard packages to die-size and wafer-level stacking processes. While each process may vary, they all adhere to four core principles:
(*) n-High means a stack of n levels.
Our technologies reduce the size and weight of components by a factor of at least 10 compared to existing solutions. With the capability to stack up to 10 semiconductor devices within 1 mm, our 3D PLUS Ultra Low Profile Modules are unparalleled in the industry.
Our technology responds to a wide range of applications, from low-volume, space-qualified projects to high-volume industrial uses. 3D PLUS is uniquely qualified for space applications by major space agencies, including ESA, NASA, and JPL, making it the only technology of its kind in the world.
3D PLUS provides four different very flexible Stack Technology Flows
Standard packages stack
With the capability to stack n-High any standard packages from the industry, this process flow is based on very simple and well-proven technologies. A large products portfolio using this technology relies on TSOPs packages. This capability domain is also qualified by European Space Agency (ESA) for Space applications.
Flex Process-Die Stack
With the capability to stack n-High any non-modified standard die (even with different sizes and technology), this process flow enables to embed the best semiconductors together in one single highly miniaturized package. High reliability and resistance to harsh environments, and very good manufacturing yield are also key benefits of this die stacking technology.
Flex Process- SIP Stack
This process has the unique capability to stack n-High any heterogeneous active, passive and opto-electroniques devices in a single highly miniaturized package. This is the most efficient technology for the building complex System-in-Packages (SiPs). This capability domain is also qualified by European Space Agency (ESA) for Space Application.
Wafer Level Stack WDOD™
Based on the use of standard wafers (die without “TSV”), and with the capability to stack die with different sizes up to 10 levels, our wafer level stack technology named WDoD™ (Wirefree Die-on-Die) achieves smaller forms factors and Ultra Low Profile 3D stack.
Depending on the product’s performance requirements and targeted market, the relevant stacking process will be selected within 3D PLUS technology portfolio in order to bring the best added value and benefits for our customers designs.
