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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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3D PLUS specializes in delivering compact, high-performance DDR4 SDRAM memory modules designed for applications that demand robust and reliable high-speed computing memory. Our modules integrate termination resistors and decoupling capacitors, ensuring optimal performance and durability. Leveraging our advanced stacking technology, 3D PLUS DDR4 SDRAM ruggedized modules offer exceptional reliability in BGA packages, making them ideal for harsh environments. With a high density of up to 128 Gbit, a bus width of 72 bits, and fast data transfer rates up to 2400 Mbps, these modules are engineered for efficiency and speed.
Applications in Military and Defense
Available in both Industrial and Military temperature ranges, these modules ensure operation in extreme conditions, making them perfect for military and defense applications. Additionally, 3D PLUS guarantees long-term supply continuity, ensuring sustained support for your projects.
Our DDR4 memory modules are specifically engineered for use in the military and defense industries, where reliability and performance under harsh conditions are critical. Whether it’s for aerospace, naval, or ground-based systems, 3D PLUS ensures that your memory solutions meet the highest standards of durability and efficiency.
Density up to 128 Gbit
Bus width: 72 bits
Data transfer: 2400 Mbps
Decoupling capacitors and Termination resistors included
Available in Industrial and Military temperature range
Long term supply continuity
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
