EN FR

Actualités Evénements

  • Sept. 16-18, 2025

    𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓 Here we go!

    Join 3D PLUS at the 25th European Microelectronics & Packaging Conference (𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓) in Grenoble, France. We will be presenting at the 𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓 conference on September 18, 2025, at 11:30 a.m. Jean-Michel Guinet will discuss "𝐇𝐢𝐠𝐡 𝐝𝐞𝐧𝐬𝐢𝐭𝐲 𝟑𝐃 𝐢𝐧𝐭𝐞𝐫𝐜𝐨𝐧𝐧𝐞𝐜𝐭𝐢𝐨𝐧𝐬 𝐟𝐨𝐫 𝐡𝐢𝐠𝐡 𝐩𝐞𝐫𝐟𝐨𝐫𝐦𝐚𝐧𝐜𝐞 𝐂𝐝𝐓𝐞 𝐛𝐚𝐬𝐞𝐝 𝐗-𝐫𝐚𝐲𝐬 𝐝𝐞𝐭𝐞𝐜𝐭𝐨𝐫𝐬", a collaborative project by 3D PLUS, CEA, and CNES.

    Plus d'informations

  • Sept. 29th to Oct. 3rd 2025

    We will be at RADECS Industrial Exhibitions!

    3D PLUS will participate at 3D PLUS will participate at the RAWe will be at RADECS Industrial Exhibitions! We will present "SEE Characterization of the 4 Tb 3DFN4T16LB1862 and 8 Tb 3DFN8T16LB2821 3D NAND flash memories for space application" during the poster session.

    Plus d'informations