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Actualités Evénements

  • Sept. 16-18, 2025

    𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓 Here we go!

    Join 3D PLUS at the 25th European Microelectronics & Packaging Conference (𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓) in Grenoble, France. We will be presenting at the 𝐄𝐌𝐏𝐂 𝟐𝟎𝟐𝟓 conference on September 18, 2025, at 11:30 a.m. Jean-Michel Guinet will discuss "𝐇𝐢𝐠𝐡 𝐝𝐞𝐧𝐬𝐢𝐭𝐲 𝟑𝐃 𝐢𝐧𝐭𝐞𝐫𝐜𝐨𝐧𝐧𝐞𝐜𝐭𝐢𝐨𝐧𝐬 𝐟𝐨𝐫 𝐡𝐢𝐠𝐡 𝐩𝐞𝐫𝐟𝐨𝐫𝐦𝐚𝐧𝐜𝐞 𝐂𝐝𝐓𝐞 𝐛𝐚𝐬𝐞𝐝 𝐗-𝐫𝐚𝐲𝐬 𝐝𝐞𝐭𝐞𝐜𝐭𝐨𝐫𝐬", a collaborative project by 3D PLUS, CEA, and CNES.

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  • Sept. 29th to Oct. 3rd 2025

    We will be at RADECS Industrial Exhibitions!

    3D PLUS will participate will be at RADECS Industrial Exhibitions! We will present "SEE Characterization of the 4 Tb 3DFN4T16LB1862 and 8 Tb 3DFN8T16LB2821 3D NAND flash memories for space application" during the poster session.

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