Our Company


3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive and Opto-electronics devices in a single highly miniaturized package.
Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components. It responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications.
Benefiting from high Quality standards based on the ISO9001 certification, our 3D stacking technology is the sole worldwide qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications.
3D PLUS standard products and System-In-Package (SiP) solutions are used in high technology industries for industrial, computer boards & embedded systems, defense & security, aircrafts & avionics, medical & sciences and aerospace applications.

Key Information

1 554 867 €

Incorporation Date:
October 1995

Shareholding structure:
subsidiary of the Electronic Technology Group of the HEICO Corporation (NYSE:HEI.A and HEI)

300 employees

3D PLUS SA Registration:
Versailles Trade & Companies Register N°: B 402 523 088
VAT N°: FR77402523088

3D PLUS USA Registration:
Cage Code: 3FBQ6
DUNS: 109955232

Export Control:
3D PLUS complies with all applicable export control laws and regulations.
3D PLUS catalog products and SiPs technology are not subject to US-Export Regulations such as EAR and ITAR. They can be delivered worldwide.
For activities requesting exchange of projects’ information with its US customers, 3D PLUS USA Inc. and 3D PLUS SA comply with the regulations of the International Traffic in Arms Regulation for non-classified programs. All employees are trained and comply to the document and data controls required by ITAR. 3D Plus Empowered Official is available at 3D PLUS USA to answer any compliance questions you might have.

Locations (click on the map for google maps directions)


408, rue Hélène Boucher - ZI
78530 BUC, France

Phone: +33 (0) 130 832 650
Fax: +33 (0) 139 562 589

Technical Center (USA)

151 Callan Ave, Suite 310
San Leandro CA 94577

Phone (CA): +1 510 824 5591
Phone (TX): +1 972 672-2865
Phone (MD): + 1 410 274 5200


Security and entrance procedure

Foreign National visitors are requested to provide detail personal information for security clearance a least one week prior to their visit.
In order to gain access to 3D PLUS site, each visitor will have to check in at the visitor’s front desk and present a valid ID for registration.


The visitor’s badge shall be worn visibly at all times.
Overshoes for ESD protection and site cleanliness are delivered at the visitor’s front desk and shall be worn at all times while visiting our facility.
3D PLUS activities require hazardous materials and equipment. Therefore, Hazard-warning signs must be obeyed at all times. Unauthorized access to restricted areas is strictly forbidden.
3D PLUS is a smoke free facility. Smoking is only allowed outside the building in designated areas.
The use of photo and video cameras is strictly forbidden while visiting 3D PLUS premises.

Directions and hotels nearby 3D PLUS Headquarters

Located in the south of Paris, near Versailles, our headquarters are within driving distance of all major Paris Area Airports and can also be reached by public transportation.
In anticipation of your visit, a selection of hotels nearby 3D PLUS and More information on how to reach us is available in our welcome pack here.


Inventor of 3D stacked Electronics for Space


High Quality referential with ISO and Space Agencies Certifications


Our support teams are everywhere you are to ensure your satisfaction


Rugged components able to withstand harsh environments and space radiation effects


Dense, fast, rad hardened, System in Packages, miniaturized


Over 20 years of flight heritage and 190,000 modules in Space