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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
COMBO (3DCO0849) is an advanced boot manager designed to efficiently configure AMD Versal™ XQR Adaptive SoCs in the most demanding space environments. Radiation Hardened by Design, COMBO delivers the highest available storage density on the market for space applications, making it a powerful and reliable solution for mission‑critical systems.
This plug‑and‑play, all‑in‑one module combines all the essential hardware resources required to configure the FPGA, simplifying system architecture while maximizing performance and reliability. With an impressive 16 Gb storage capacity, COMBO supports multiple large bitstreams as well as file and operating system storage for embedded processors.
Designed for robustness, flexibility, and ease of integration, COMBO is the ideal solution for next‑generation space platforms, enabling high‑performance reconfigurable computing with confidence.
Download the 3D PLUS COMBO Datasheet
