MNEMOSYNE A SPACE NON-VOLATILE MEMORY ASIC

Inspired by the memory goddess herself, MNEMOSYNE is a cutting-edge, radiation-immune non-volatile memory (NVM) based on 22 nm STT-MRAM FDSOI technology. Developed under the EU-funded H2020 MNEMOSYNE project, this ASIC is designed to meet the rigorous demands of space applications, ensuring high reliability, guaranteed long-term supply, and full European manufacturing. More details on the EU project visit mnemosyne-project.

To achieve industry-leading density, MNEMOSYNE modules integrates stacked radiation-immune memory ASICs, delivering superior data retention and extreme write endurance. The modules are available with serial or parallel interfaces and come in SOP packages for robust SMT assembly, ensuring resilience in harsh thermal and mechanical environments.

With its unmatched reliability and density, MNEMOSYNE is the ideal solution for configuring the latest SRAM-based FPGAs and serving as secure boot/program storage for next-generation processors.

Key features

• 

  Interfaces (only one at time):

  Serial

  Parallel

• 

  Modes supported:

  SPI, DSPI, QSPI, OSPI for serial interface

  EEPROM for parallel interface

• 

  Voltage supply:

  1.8 V

  1.8 V & 3.3 V

• 

  Radiation Performances:

  TID > 100 krad(Si)

  SEL LET_th > 85 MeV.cm²/mg @ 125 °C

  SEU LET_th > 85 MeV.cm²/mg

  SEFI LET_th > 85 MeV.cm²/mg

  SET LET_th > 85 MeV.cm²/mg

• 

  Operating temperature: -55 °C to +125 °C

  Endurace: 100, 000 P/E cycles

  Data retention: 20 years

  Embedded ECC

• 

  Worldwide Delivery Guaranty

Key Benefits

• 

  Space grade high density configuration memory –
  Up to 1 Gb of SEE Immune Storage

• 

  Best in class regarding reliability
  (data retention, P/E cycles, radiation)

• 

  Data reliability guaranteed, no need for external ECC.

MNEMOSYNE Space Memory ASIC Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

• The product’s Part Number
• The temperature range
• The screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Memory Part Number Decoder

Design Tools

128 Mb 3.3 V parallel

512 Mb 1.8 V SPI

1 Gb 1.8 V SPI

512 Mb 3.3V SPI

1 Gb 3.3V SPI