3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
From 4 Mb to 32 Mb, our Radiation Tolerant asynchronous SRAM stacks enable high-density and high-speed data transfer solutions. Powered by 3.3 V or 5.0 V, the memories feature a wide range of data bus widths: x8b, x16b, x32b or x40b and an acces time of 12 ns, making them the fastest SRAMs on the space market. They are offered in compact SOP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
First released to the market in 2000, 3D PLUS SRAM products are used as processor RAM in a variety of high performance computer boards in diverse fields of space applications such as science and deep space missions, Earth observation, launchers and manned space vehicles, navigation satellites, etc. , provides an interesting flight heritage. These memory modules have been used on missions such as Bepicolombo, Mars 2020, and others.
High speed 12 ns
Scalability with no loss of access time performance
TID >100 krad(Si)
SEL LETth >110 MeV.cm²/mg
SEU LETth : 0.7 MeV.cm²/mg ;
σsat = 6E-8 cm²/bit
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Space qualified (S)
Space quality level and very large flight heritage worldwide
No pure tin guarantee
Significant board area savings (more than 85 % space savings in the design)
Optimized development time and cost.
Long life cycle products with proven reliability in Space
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: Application Notes, IBIS, RTL, Step and Mechanical file, Radiation Report.