3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
PROM are One-Time only Programmable (OTP) non volatile memories. 3D PLUS PROMs are based on rugged memory cell technology and manufactured on epitaxial semiconductor substrates. Our stacking process, allows us to offer up to 128 Mb PROM, in SOP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.
First released in 2013, 3D PLUS PROMs are a sweet fit to be used as processor’s boot and program PROM in a variety of high performance and high reliability computer boards. These memory modules have been used on missions such as ISS-ASIM Observatory, CYGNISS, and others.
Non volatile and One-Time Programmable
Serial or 8-bit parallel interface
20 years data retention
Worldwide delivery guarantee
TID > 50 krad (Si)
SEL Immune, LETth > 120 MeV.cm²/mg
SEU Immune, LETth > 120 MeV.cm²/mg
No pure tin guarantee
Flight heritage with technology proven for 15 to 18 years missions in space
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Climate observation and study