memory PROM

Overview

PROM are One-Time only Programmable (OTP) non volatile memories. 3D PLUS PROMs are based on rugged memory cell technology and manufactured on epitaxial semiconductor substrates. Our stacking process, allows us to offer up to 128 Mb PROM, in SOP package for high resistance Surface Mount (SMT) assembly and withstanding harsh thermal and mechanical environments.

First released in 2013, 3D PLUS PROMs are a sweet fit to be used as processor’s boot and program PROM in a variety of high performance and high reliability computer boards. These memory modules have been used on missions such as ISS-ASIM Observatory, CYGNISS, and others.

Key features

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  Non volatile and One-Time Programmable

  Serial or 8-bit parallel interface

  20 years data retention

  Worldwide delivery guarantee

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  Radiation tolerance:

  TID > 50 krad (Si)

  SEL Immune, LET_th > 120 MeV.cm²/mg

  SEU Immune, LET_th > 120 MeV.cm²/mg

• 

  No pure tin guarantee

  Flight heritage with technology proven for 15 to 18 years missions in space

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

• The product’s Part Number
• The temperature range
• The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Design Tools

32 Mb

64 Mb

128 Mb