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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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Our advanced High-Density NAND Flash Memory solutions address the increasing need for large-capacity, reliable data storage in space systems. Utilizing Triple-Level Cell (TLC) technology, these devices store three bits per cell, enabling significantly greater density compared to traditional Single-Level Cell (SLC) memories. However, this increase in capacity comes at the cost of reduced endurance and greater sensitivity to errors, which must be managed through advanced error correction and wear-leveling techniques.
In space environments, commercial TLC NAND is vulnerable to radiation-induced errors such as Total Ionizing Dose (TID) effects and Single-Event Effects (SEE), risking data corruption or device latch-up. Our high-density NAND Flash addresses these challenges by operating in programmed SLC (p-SLC) mode, significantly improving endurance and radiation hardness while maintaining high storage capacity. The devices exhibit strong immunity to Single-Event Latch-up (SEL) with LET thresholds above 62.5 MeV·cm²/mg, tolerate TID levels up to 30 krad(Si), and support up to 60,000 program/erase cycles. Designed for seamless integration into aerospace systems, they comply with ONFI 4.2 standards and support NV-DDR3 interfaces at speeds up to 600 MHz.
Packaged in space-qualified, these memory modules are ideal for onboard recorders, satellite payload data storage, and other mission-critical aerospace applications.
ONFI 4.2 compliance
Support for NV-DDR3 interface at frequencies up to 600 MHz
60, 000 program/erase cycles capability (p-SLC mode)
5 years data retention (SLC mode)
Radiation tolerance (p-SLC mode):
TID > 30 krad (Si)
SEL LETth > 62.5 MeV.cm²/mg
SEU LETth < 32.4 MeV.cm²/mg ; σsat = 2E-10 cm²/bit
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
Fast read page time of 40 μs (typical)
Program page time around 600 μs
Erase block time about 8 ms
No pure tin guarantee
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
