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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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The 3DCO0849 is a space grade COnfiguration Memory BOot manager COMBO to boot SRAM based FPGAs and MPSoCs requiring a large configuration memory.
3D PLUS’s COMBO module provides a unique solution that combines all required hardware resources into a single module to boot SRAM based FPGAs with the smallest PCB footprint available in the market.
COMBO Part Number Decoder
Module Configuration
Power Supply: 1.2V, 2.5V, 3.3V
Temperature Range: -40°C to +105°C
High level of miniaturization : 32 x 32 mm² area, 22 g
Radiation Performances
TID > 50 krad (Si)
SEL LET > 62.5 MeV.cm²/mg
Supporting different SRAM FPGA types
AMD Xilinx Versal ACAP,
AMD Xilinx Ultrascale / Ultrascale+,
AMD Xilinx 7 Series, 6 Series, 5 Series,
NanoXplore NG-ULTRA, ULTRA 300.
Storage capability
Integrating a 64 Gb RT NAND Flash capable of storing multiple large configuration bitstreams for FPGAs and their embedded processors and data files.
Booting capability
Booting SRAM based FPGAs from the required configuration image stored in the NAND Flash
Reliability performance
Supporting functionalities to provide data integrity for stored bitstreams to achieve mission in space environment.
High density full space grade solution to boot high- end SRAM based FPGAs
Multiple reliable bitstream images management with data integrity
Key solution for on-orbit reconfiguration
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Pitch 1,27mm
