The 3DCO0849 is a space grade COnfiguration Memory BOot manager COMBO  to boot SRAM based FPGAs and MPSoCs requiring a large configuration memory.

3D PLUS’s COMBO module provides a unique solution that combines all required hardware resources into a single module to boot  SRAM based FPGAs with the smallest PCB footprint available in the market.

COMBO Part Number Decoder

Key features

  • Module Configuration

    Power Supply: 1.2V, 2.5V, 3.3V

    Temperature Range: -40°C to +105°C

    High level of miniaturization : 32 x 32 mm² area, 22 g


  • Radiation Performances

    TID > 50 krad (Si)

    SEL LET > 62.5 MeV.cm²/mg

  • Supporting different SRAM FPGA types

    AMD Xilinx Versal ACAP,

    AMD Xilinx Ultrascale / Ultrascale+,

    AMD Xilinx  7 Series, 6 Series, 5 Series,

    NanoXplore NG-ULTRA, ULTRA 300.

  • Storage capability

    Integrating a 64 Gb RT NAND Flash capable of storing multiple large configuration bitstreams for FPGAs and their embedded processors and data files.

  • Booting capability

    Booting SRAM based FPGAs from the required configuration image stored in the NAND Flash


  • Reliability performance

    Supporting functionalities to provide data integrity for stored bitstreams to achieve mission in space environment.

Key Benefits

  • High density full space grade solution to boot high- end SRAM based FPGAs



  • Multiple reliable bitstream images management with data integrity


  • Key solution for on-orbit reconfiguration


Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Product Part Number Description Package Temperature
COMBO 3DMCO0849 Space grade COnfiguration Memory BOot manager COMBO 483 balls BGA

Pitch 1,27mm

-40 °C to +105 °C



Product Part Number Flyer
COMBO 3DCO0849 Flyer PDF - 1141ko Download