SRAM
Overview
4Mb to 32Mb High speed and Radiation Tolerant asynchronous SRAM are available in a variety of temperature ranges, organized x8, x16, x32 and x40, with a single power supply of 3.3V or 5V. The devices are offered with standard SOP footprint for high resistance SMT assembly and for withstanding harsh thermal and mechanical environments.
3D PLUS SRAM products are used as processor’s RAM in a variety of high performance computer boards in all the space application fields: sciences and deep space missions, Earth observation, navigation, launch and manned space vehicles, and telecommunications satellites.
Key Features
High density – smallest footprint (more than 85 % space savings in the design)
High speed 12 ns
Scalability with no loss of access time performance
Radiation tolerance:
- TID: >100 krad(Si)
- SEL: >110 MeV.cm²/mg
- SEU: 0.7 MeV.cm²/mg ; Saturated cross-section 6E-8 cm²/bit
Space quality level and very large flight heritage worldwide
No pure tin guarantee (less than 97% tin guarantee)
Very long life time electronics (technology proven for 15 to 18 years missions in space)
Worldwide delivery guarantee
Lineup
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3DSR4M08VS1520 | 512k x 8 | 3.3 V | 12 ns | SOP44 | C, I, M | 3DPA-7760 |
| 3DSR4M16VS1690 | 256k x 16 | 3.3 V | 12 ns | SOP44 | C, I, M | 3DPA-6470 |
| 3DSR4M08CS1647 | 512k x 8 | 5V | 12 ns | SOP44 | C, I, M | 3DPA-5610 |
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3DSR8M16VS2505 | 512k x 16 | 3.3V | 12 ns | SOP54 | C, I, M | 3DPA-3300 |
| 3DSR8M16CS2510 | 512k x 16 | 5V | 12 ns | SOP54 | C, I, M | 3DPA-4080 |
| 3DSR8M32VS2503 | 256k x 32 | 3.3V | 12 ns | SOP64 | C, I, M | 3DPA-3290 |
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3DSR16M08CS4660 | 2M x 8 | 5V | 12 ns | SOP44 | C, I, M | 3DFP-0660 |
| 3DSR16M16VS4502 | 1M x 16 | 3.3V | 12 ns | SOP54 | C, I, M | 3DPA-3280 |
| 3DSR16M16CS4512 | 1M x 16 | 5V | 12 ns | SOP54 | C, I, M | 3DPA-3770 |
| 3DSR16M32VS4500 | 512k x 32 | 3.3V | 12 ns | SOP64 | C, I, M | 3DPA-3230 |
| 3DSR16M32CS4511 | 512k x 32 | 5V | 12 ns | SOP64 | C, I, M | 3DPA-3780 |
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3DSR20M40VS2708 | 512k x 40 | 3.3V | 12 ns | SOP84 | C, I, M | 3DPA-6860 |
| Part Number | Configuration | Voltage | Clock Rate / Access time | Package | Temperature | SCD# |
|---|---|---|---|---|---|---|
| 3DSR32M16VS8506 | 2M x16 | 3.3 V | 12 ns | SOP54 | C, I, M | 3DPA-4390 |
| 3DSR32M32VS8504 | 1M x32 | 3.3 V | 12 ns | SOP68 | C, I, M | 3DPA-3800 |
| 3DSR32M32VS8501 | 1M x 32 | 3.3V | 12 ns | SOP68 | C, I, M | 3DPA-3270 |
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 20 years of flight heritage and 190,000 modules in Space