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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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Operating at 3.3 V or 5.0 V, ranging from 4 Mb to 32 Mb and offering high-density and high-speed data transfer capabilities, the Radiation Tolerant SRAMs support a wide range of data bus widths – x8b, x16b, x32b, or x40b – with an impressive access time of 12 ns, making them the fastest SRAMs available for space applications.
Designed to withstand the rigors of space, 3D PLUS SRAM memories are offered in compact SOP packages, ensuring high resistance Surface Mount (SMT) assembly and durability in harsh thermal and mechanical environments. Since their initial release in 2000, 3D PLUS SRAM space memories have been the preferred choice for processor RAM in high-performance computer boards across a spectrum of space applications, including science and deep space missions, Earth observation, launchers, manned space vehicles, and navigation satellites.
With a proven record of accomplishment of reliability and performance, 3D PLUS SRAM memories have been integral to numerous space missions, providing critical support and reliable performance in demanding environments. 3D PLUS radiation-tolerant SRAM memories have been utilized on missions such as BepiColombo, Mars 2020 , and many others, highlighting their exceptional reliability and resilience in space. For over two decades, 3D PLUS has been at the forefront of supplying cutting-edge Radiation Tolerant SRAM memory solutions to the space application market. With a focus on density, radiation tolerance, and space qualification, 3D PLUS continues to be the trusted choice for high-performance memory solutions in the space industry.
High density
High speed 12 ns
Scalability with no loss of access time performance
Radiation tolerance:
TID >100 krad(Si)
SEL LETth >110 MeV.cm²/mg
SEU LETth : 0.7 MeV.cm²/mg ; σsat = 6E-8 cm²/bit
Available in all 3D PLUS screening and qualification options:
Commercial (C )
Industrial (I)
Space qualified (S)
Space quality level and very large flight heritage worldwide
No pure tin guarantee
Significant board area savings (more than 85 % space savings in the design)
Optimized development time and cost.
Long life cycle products with proven reliability in Space
Worldwide delivery guarantee
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information. Memory Part Number Decoder
SOP 68
Other technical documentation is available under request: Application Notes, IBIS, RTL, Step and Mechanical file, Radiation Report.
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