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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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The FUSIO RT family provides a reprogrammable Rad Hard By Design RHBD SRAM-based FPGA with high reliability embedded memories: a 128 Mbit TMR configuration memory, in addition to optional computing and data storage memories, all integrated in one single miniaturized package.
The FUSIO RT products are ideal for system applications requiring performance, density and high reliability such as telecommunication satellites or experimental instruments.
Leading edge European reprogrammable FPGA ressources:
Modularity, upgradable computer core: one footprint for 4 configurations High level of miniaturization: 483 balls BGA, (32 x 32) mm² area
Enhanced radiation performances achieved by technology and by design:
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Computer, Power and SiP Part Number Decoder
Pitch 1.27mm
