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3D PLUS a plus de 210 000 composants microélectroniques dans l’espace, et plus de 25 ans d’expérience de vol sans aucune défaillance signalée. Notre patrimoine de vol se développe continuellement avec des produits lancés dans l’espace tous les mois en orbites LEO, MEO et GEO, pour des missions d’exploration de l’espace lointain, pour des flottes de constellations de satellites, et pour des missions gouvernementales en Europe, en Amérique et en Asie. Nos missions phares comprennent Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, et bien d’autres encore.
Demande d'information
3D PLUS offers high-density NOR Flash memory stacks ranging from 512 Mb to 2 Gb, designed for applications requiring reliable, high-performance memory solutions. These stacks feature a x16 organization and operate at a 3.0V power supply, ensuring optimal energy efficiency and seamless integration into your systems.
Available in industrial and military temperature ranges, our ruggedized NOR Flash stacks are built to thrive in harsh environments, making them ideal for aerospace, defense, and industrial applications. With 3D PLUS, you benefit from long-term supply continuity and exceptional durability, ensuring your projects remain supported for years to come.
Up to 2Gb Memory Density
Small form factor and low profile
8-word/16-byte page read buffer
100,000 erase cycles per sector typical
High Speed – 90ns to 130ns access time
20 years data retention typical
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
Memory Part Number Decoder
Other technical documentation is available under request: IBIS and mechanical file.
