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Memory DDR3 SDRAM INDUSTRIAL

Demande d'information

  • DDR3 memory for harsh environments 3D3D16G72WB2768 -3D PLUS
    DDR3 memory for harsh environments 3D3D16G72WB2768 -3D PLUS DDR3 SDRAM INDUSTRIAL
  • DDR3 memory for harsh environments 3D3D4G08WB1473 -3D PLUS
    DDR3 memory for harsh environments 3D3D4G08WB1473 -3D PLUS
  • DDR3 memory for harsh environments 3D3D16G16WB2659 -3D PLUS
    DDR3 memory for harsh environments 3D3D16G16WB2659 -3D PLUS
Demande d'information

High-Performance DDR3 Memory Modules for Harsh Environments, Military,  Avionics, and Defense Applications

3D PLUS specializes in delivering compact, high-performance DDR3 SDRAM memory modules designed for applications that demand robust and reliable high-speed computing memory. Our modules integrate termination resistors and decoupling capacitors, ensuring optimal performance and durability. Leveraging our advanced stacking technology, 3D PLUS DDR3 ruggedized modules offer exceptional reliability in BGA packages, making them ideal for harsh environments.

Applications in Harsh Environments

Our DDR3 memory modules are specifically engineered for use in industries where reliability and performance under harsh conditions are critical. Whether it’s for aerospace, defense, or industrial applications, 3D PLUS ensures that your memory solutions meet the highest standards of durability and efficiency.

Key features

  • Up to 32Gb Memory Density

  • Wide Data bus x8, x16, x32 and x72

  • Small form factor and low profile

  • Extended/Specific temperature range

  • Lead free or SnPb solderballs

  • Excellent signal Integrity and High Reliability

Line up DDR3 memory for harsh environments 3D3D4G08WB1473 -3D PLUS

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

Memory Part Number Decoder

 

Part Number Density Configuration Voltage Clock rate Package Temperature Balls
3D3D4G08WB1473 4Gbit 512Mbit x 8 1.5 V 533 – 800 MHz BGA 78 I, M RoHS
3D3D4G16WB1627  4Gbit 256Mbit x 16 1.5 V 533 – 800 MHz BGA 96 I, S, M RoHS
3D3D8G08WB1616 8Gbit 2 x (512Mbit x 8) 1.5 V 533 – 800 MHz BGA 78 I, M RoHS
3D3D8G32WB1741  8Gbit 256Mbit x 32 1.5 V 533 – 800 MHz BGA 136 I, S, M SnPb / RoHS
3D3D8G32YB1741  8Gbit 256Mbit x 32 1.35 V 533 – 800 MHz BGA 136 I, S, M SnPb / RoHS
3D3D16G16WB2659 16Gbit 2 x (512Mbit x 16) 1.5 V 533 – 667 MHz BGA 96 I, S, M SnPb
3D3D16G32WB2650 16Gbit 512Mbit x 32 1.5 V 533 – 667 MHz BGA 136 I, S, M SnPb
3D3D16G72WB2768 16Gbit 256Mbit x 72 1.35 V
1.5 V		 533 – 667 MHz BGA 223 I, S, M SnPb

Documentation

Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.

P/N Density Data Sheet
3D3D4G08WB1473 4Gbit Data Sheet PDF - 1497ko Télécharger
3D3D4G16WB1627 4Gbit Data Sheet PDF - 1261ko Télécharger
3D3D8G08WB1616 8Gbit Data Sheet PDF - 1154ko Télécharger
3D3D8G32WB1741 8Gbit Data Sheet PDF - 2412ko Télécharger
3D3D8G32YB1741 8Gbit Data Sheet PDF - 2412ko Télécharger
3D3D16G16WB2659 16Gbit Data Sheet PDF - 1600ko Télécharger
3D3D16G32WB2650 16Gbit Data Sheet PDF - 1635ko Télécharger
3D3D16G72WB2768 16Gbit Data Sheet PDF - 817ko Télécharger