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News & Events

Welcome to 3D PLUS News & Events section where a variety of products and technology announcements, upcoming events and corporate news are presented. Don’t hesitate to contact us for more information.

Press

17/07/2017 -

HEICO News

HEICO CEO Laurans A. Mendelson named to French Legion of Honor.

Consult the press release.

18/04/2017 -

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

Pascal Couderc, 3D PLUS' Research and Development Manager, deals with the Wire-free Die-on-die Technology in 3D InCities.

09/03/2017 - Press release

Sentinel-2B, the second satellite of ESA's Sentinel-2 mission, integrates 3D PLUS' memory modules

We are proud to announce that our 4Mb EEPROM and 4Gb SDRAM are embedded abroad Sentinel-2B, the second Sentinel-2 satellite.

20/02/2017 - Press release

3D PLUS' memory modules aboard the SpaceX CRS-10 mission

The STP-H5/ISEM (STP-Houston 5, ISS SpaceCube Experiment Mini) payload includes four different types of onboard computers that integrate 3D PLUS’ parts.

16/12/2016 - Press Release

Once again, a NASA's mission includes 3D PLUS' modules

3D PLUS is proud to announce that some of its highly reliable and radiation tolerant memory modules are used in CYGNSS (Cyclone Global Navigation Satellite System), the NASA's hurricane prediction mission launched yesterday.

26/09/2016 - Press Release

3D PLUS modules launched aboard NASA's OSIRIS-REx spacecraft

3D PLUS annouces its participation in NASA's OSIRIS-REx mission providing 256Mb NOR Flash and 4Gb SDRAM, used in the avionics for the spacecraft.

30/06/2016 - Press Release

3D PLUS USA received the 2016 Supplier Trust and Recognition Award from NASA JPL

We are very proud to announce you that 3D PLUS USA received the Supplier Trust and Recognition Award from NASA JPL for providing outstanding customer service by going above and beyond to support JPL mission success.

29/06/2016 - Press Release CNES

3D PLUS latest-generation space qualified 4 Mp CMOS Camera to fly to the Moon in 2017 with the Team Indus mission

French Space Agency CNES and Indian firm Axiom Research Labs signed an agreement to contribute to the Team Indus mission that is set to land a module and rover on the Moon in 2017. France will supply latest-generation CMOS micro-cameras developed in partnership with French firm 3D PLUS.

02/06/2016 - Press Release

3D PLUS unveils its partnership with Sodern for the supply of camera modules embedded in constellations and small-sat star tracker applications

3D PLUS announces a partnership with Sodern for the design and manufacturing of camera modules to be integrated in the Auriga star tracker targeted for constellations and small-sat applications

Events

24/10/2017 -

SPACE TECH EXPO EUROPE, BREMEN, GERMANY, 24TH TO 26TH OCTOBER, 2017

We will be attending to the next Space Tech Expo Europe 2017 in Bremen.
Don't miss 3D PLUS team booth A20 and learn more about our space products and our camera through a live demo. 
We look forward to meeting you!

11/10/2017 -

ASD DAYS, PARIS ORLY, FRANCE, 11th to 12th OCTOBER, 2017

We are pleased to announce our participation to the next ASD Days! We will present our wide offering of products and offer a demonstration of our space qualified camera.

Come visit our team during the event to learn more about 3D PLUS and its innovative solutions.

03/10/2017 -

RADECS, GENEVA, SWITZERLAND, 3RD to 5TH OCTOBER, 2017

3D PLUS will be exhibiting at the next RADECS conference to present its high-performance radiation tolerant modules dediacated to space.

25/09/2017 -

INTERNATIONAL ASTRONAUTICAL CONGRESS, ADELAIDE, AUSTRALIA, 25TH TO 29TH SEPTEMBER, 2017

Meet our team booth 39 at the 68th International Astronautical Congress and discover our innovative solutions for space applications.

30/05/2017 -

DASIA, GOTHENBURG, SWEDEN, 30TH MAY TO 1ST JUNE, 2017

3D PLUS is pleased to annouce its participation at the next DASIA conference to present its innovative products and solutions dedicated to space applications such as our DDR3 SDRAM Memory module.

 

14/03/2017 -

EMBEDDED WORLD, NUREMBERG, GERMANY, 14TH TO 16TH MARCH, 2017

3D PLUS will be exhibiting at the Embedded World fair trade, come meet our team in the hall 1, booth 1-400 to discover our products and discuss your projects needs.

08/03/2017 -

PARIS SPACE WEEK (PSW), PARIS ORLY, FRANCE, 8th AND 9th MARCH, 2017

We are pleased to annouce our exhibition at the next PARIS SPACE WEEK. We will be showcasing our high-performance and high-reliability modules and offering a demonstration of our new space camera 3DCM681-1.
Don't miss this event and come visit us in the village "Embedded Technologies".

14/11/2016 -

COMPAMED, DÜSSELDORF, GERMANY, 14th TO 17th NOVEMBER, 2016

3D PLUS will be exhibiting at the next Compamed Conference to show our products dedicated to medical applications, including our camera 3DCM691-1.

Please, come meet us in the Hall 8a, stand R09, we look forward to seeing you. 

01/11/2016 -

MILCOM, BALTIMORE, MD, USA, 1st to 3rd NOVEMBER, 2016

The 3D PLUS team will be present at the MILCOM Conference on the stand no.3003. We would be happy to meet you and show you the 3D PLUS products dedicated to military applications.
We hope to see you there.

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVNESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 16 years of flight heritage and 100 000 modules in Space