News & Events
Welcome to 3D PLUS News & Events section where a variety of products and technology announcements, upcoming events and corporate news are presented. Don’t hesitate to contact us for more information.
3D PLUS is pleased to announce its participation at the next Electronica as exhibitor. If you will be attending to this event, come visit us booth B5E02 to discover our products and discuss about your future projects.
Meet our team booth 5E31 at the 69th International Astronautical Congress and learn more about our innovative solutions for space applications.
3D PLUS will exhibit at the SMALL SAT conference in Logan (UT), USA.
Meet us booth T45, we will be pleased to welcome you and discuss about our new innovative products for space applications.
Don't miss us during the Toulouse Space Show 2018, an international event dedicated to novel space solutions, highlighting new trends and the new space economy.
We look forward to meeting you booth E20 and talking about your space projects.
3D PLUS is pleased to annouce its participation at the next DASIA conference to present its innovative products and solutions dedicated to space applications such as our FUSIO RT, a new Space Modular Computer Core based on European Space FPGA.
We will be presenting our FUSIO RT, a new Modular Computer Core, during the 4S Symposium. Don't miss us booth 20, we will be pleased to meet you and show you our space products.
3D PLUS will be participating at the next OPTRO 2018, the 8th International Symposium on Optronics in Defence and Security.
Don't miss us booth 4 to learn more about our camera dedicated to space applications and our customized solutions suitable for harsh environments and complex usage.
We will be attending to the next Space Tech Expo Europe 2017 in Bremen.
Don't miss 3D PLUS team booth A20 and learn more about our space products and our camera through a live demo.
We look forward to meeting you!
3D PLUS has provided multiple memory moduly (NAND Flash, NOR Flash, SDRAM, SRAM, EEPROM) on-board InSight lander and MarCO A and B CubSats built by JPL.
3D PLUS supplied several memory modules (SRAM, EEPROM and SDRAM), POL Converters and custom low noise amplifier for BepiColombo, a joint mission of JAXA and ESA, launched on October 20th.
3D PLUS has supplied high performance memory modules to Mitsubishi Electric Corporation and received the Best Supplier Award of the year.
After a 4 years trip in space, MASCOT successfully landed on Ryugu’s south hemisphere. 3D PLUS supplied high density radiation tolerant modules integrated in the MASCOT's data acquisition and mass memory board and the on-board computer.
DEVELOPMENT AND APPLICATION TECHNOLOGY VOLUME HYBRID INTEGRATED CIRCUITS IN SPACECRAFT REMOTE SENSING OF THE EARTH
Consult our article about the technologies of creation and application of new highly reliable hybrid assemblies for use in spacecraft of Earth remote sensing and radio equipment orbital groups.
HEICO CEO Laurans A. Mendelson named to French Legion of Honor.
Consult the press release.
Pascal Couderc, 3D PLUS' Research and Development Manager, deals with the Wire-free Die-on-die Technology in 3D InCities.
09/03/2017 - Press release
We are proud to announce that our 4Mb EEPROM and 4Gb SDRAM are embedded abroad Sentinel-2B, the second Sentinel-2 satellite.
20/02/2017 - Press release
The STP-H5/ISEM (STP-Houston 5, ISS SpaceCube Experiment Mini) payload includes four different types of onboard computers that integrate 3D PLUS’ parts.
16/12/2016 - Press Release
3D PLUS is proud to announce that some of its highly reliable and radiation tolerant memory modules are used in CYGNSS (Cyclone Global Navigation Satellite System), the NASA's hurricane prediction mission launched yesterday.
26/09/2016 - Press Release
3D PLUS annouces its participation in NASA's OSIRIS-REx mission providing 256Mb NOR Flash and 4Gb SDRAM, used in the avionics for the spacecraft.
30/06/2016 - Press Release
We are very proud to announce you that 3D PLUS USA received the Supplier Trust and Recognition Award from NASA JPL for providing outstanding customer service by going above and beyond to support JPL mission success.
29/06/2016 - Press Release CNES
3D PLUS latest-generation space qualified 4 Mp CMOS Camera to fly to the Moon in 2017 with the Team Indus mission
French Space Agency CNES and Indian firm Axiom Research Labs signed an agreement to contribute to the Team Indus mission that is set to land a module and rover on the Moon in 2017. France will supply latest-generation CMOS micro-cameras developed in partnership with French firm 3D PLUS.
02/06/2016 - Press Release
3D PLUS unveils its partnership with Sodern for the supply of camera modules embedded in constellations and small-sat star tracker applications
3D PLUS announces a partnership with Sodern for the design and manufacturing of camera modules to be integrated in the Auriga star tracker targeted for constellations and small-sat applications
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 16 years of flight heritage and 100 000 modules in Space