News & Events
Welcome to 3D PLUS News & Events section where a variety of products and technology announcements, upcoming events and corporate news are presented. Don’t hesitate to contact us for more information.
DEVELOPMENT AND APPLICATION TECHNOLOGY VOLUME HYBRID INTEGRATED CIRCUITS IN SPACECRAFT REMOTE SENSING OF THE EARTH
Consult our article about the technologies of creation and application of new highly reliable hybrid assemblies for use in spacecraft of Earth remote sensing and radio equipment orbital groups.
HEICO CEO Laurans A. Mendelson named to French Legion of Honor.
Consult the press release.
Pascal Couderc, 3D PLUS' Research and Development Manager, deals with the Wire-free Die-on-die Technology in 3D InCities.
09/03/2017 - Press release
We are proud to announce that our 4Mb EEPROM and 4Gb SDRAM are embedded abroad Sentinel-2B, the second Sentinel-2 satellite.
20/02/2017 - Press release
The STP-H5/ISEM (STP-Houston 5, ISS SpaceCube Experiment Mini) payload includes four different types of onboard computers that integrate 3D PLUS’ parts.
16/12/2016 - Press Release
3D PLUS is proud to announce that some of its highly reliable and radiation tolerant memory modules are used in CYGNSS (Cyclone Global Navigation Satellite System), the NASA's hurricane prediction mission launched yesterday.
26/09/2016 - Press Release
3D PLUS annouces its participation in NASA's OSIRIS-REx mission providing 256Mb NOR Flash and 4Gb SDRAM, used in the avionics for the spacecraft.
30/06/2016 - Press Release
We are very proud to announce you that 3D PLUS USA received the Supplier Trust and Recognition Award from NASA JPL for providing outstanding customer service by going above and beyond to support JPL mission success.
29/06/2016 - Press Release CNES
3D PLUS latest-generation space qualified 4 Mp CMOS Camera to fly to the Moon in 2017 with the Team Indus mission
French Space Agency CNES and Indian firm Axiom Research Labs signed an agreement to contribute to the Team Indus mission that is set to land a module and rover on the Moon in 2017. France will supply latest-generation CMOS micro-cameras developed in partnership with French firm 3D PLUS.
02/06/2016 - Press Release
3D PLUS unveils its partnership with Sodern for the supply of camera modules embedded in constellations and small-sat star tracker applications
3D PLUS announces a partnership with Sodern for the design and manufacturing of camera modules to be integrated in the Auriga star tracker targeted for constellations and small-sat applications
We will be attending to the next Space Tech Expo Europe 2017 in Bremen.
Don't miss 3D PLUS team booth A20 and learn more about our space products and our camera through a live demo.
We look forward to meeting you!
We are pleased to announce our participation to the next ASD Days! We will present our wide offering of products and offer a demonstration of our space qualified camera.
Come visit our team during the event to learn more about 3D PLUS and its innovative solutions.
3D PLUS will be exhibiting at the next RADECS conference to present its high-performance radiation tolerant modules dediacated to space.
Meet our team booth 39 at the 68th International Astronautical Congress and discover our innovative solutions for space applications.
3D PLUS is pleased to annouce its participation at the next DASIA conference to present its innovative products and solutions dedicated to space applications such as our DDR3 SDRAM Memory module.
3D PLUS will be exhibiting at the Embedded World fair trade, come meet our team in the hall 1, booth 1-400 to discover our products and discuss your projects needs.
We are pleased to annouce our exhibition at the next PARIS SPACE WEEK. We will be showcasing our high-performance and high-reliability modules and offering a demonstration of our new space camera 3DCM681-1.
Don't miss this event and come visit us in the village "Embedded Technologies".
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 16 years of flight heritage and 100 000 modules in Space