ASSEMBLY & HANDLING GUIDE
3300-1300-7 Manual Assembly recommendations - SnPb soldering process
3300-1301-5 - Assembly recommendations SOP and QFP Package - SnPb soldering process
Automatic assembly recommendations SOP packages (SnPb soldering process) - max temp 235C FLOW1 products only EN
3300-8044-2 Automatic assembly recommendations SOP packages (SnPb soldering process - max temp 235C EN - link to PCN024 Dec12th, 15.
3300-8283-2 - Assembly recommendations BGA package Sn10Pb90 solder balls - SnPb soldering process
3641-0790-1 Side Stacking of a SOP module - Customer Support
3641-0841-2 Underfilling of a SOP module - Customer Support
3300-2794-3 EN Automatic assembly recommendations BGA packages_Industrial applications
3641-0842-1 Mechanical reinforcement of a BGA module - Customer Support
3641-0842-1 Mechanical reinforcement of a BGA module CN
3300-9219-1 EN Handling & storage recommendations for Optoelectronic modules with connector
3DCN-0038-1: Chamfers applied on some modules at each four top corners
3DCN0037:Alternative material for the bottom substrate of 3D PLUS modules N4000.6
PCN 036 - Space grades EEPROM modules EOL
PCN 035 - Component LAT quantity change for 3D PLUS standard Flow
PCN 034 - 3DSS24G08VS3626 - RTIMS FLASH - Quality Grade availability change
PCN-0033 EEPROM modules change of basic component for Non-space grades (IB-CN-SB-MB grades)
PCN032 - Serial Number Marking
PCN031 - 2Gb SDRAM x16b 3DSD2G16VS4654 EOL and replace by 3DSD2G16VS4767.
The serial number will be marked on all quality grades modules N, B and S grades.
3D PLUS is adding an additional marking information on Industrial DDR3 4Gb product family.
Ends Of Life (EOL) all DDR1 SDRAM modules, which are based on x4 and x8b dice configurations, from the Space DDR1 SDRAM Memory portfolio
New Space Qualified Nand Flash Modules with space qualified 2Gx8b (16Gb) Nand Flash basic devices for high performance and high density space designs.
Changing the material for the basic components retinning inside of the module from Sn96Ag4 to Sn91.5Sb8.5, and this only affect 3D PLUS Flow1 process modules
3D PLUS is replacing its CCD micro-camera heads with new solutions based on CMOS technology
3D PLUS releases the DDR2 Termination Regulator version 2 (3DPM0237-2). This new version replaces the 3DPM0237-1.
3DPM0024-3 PoL module will be replaced by the new 3DPM0211-1 PoL Converter which is fully compatible and no redesign is needed.
Following the successful qualification of the 5V fast SRAM basic device in 2011.
3D PLUS continues to introduce the New Space Qualified 5V SRAM Modules with this basic device to replace the existing modules.
3D PLUS replaces the 1Gb DDR2 SDRAM basic devices embedded in its DDR2 SDRAM Memory Modules.
3D PLUS replaces the 512Mx8b Nand Flash basic devices embedded in its Space Qualified Nand Flash Memory Modules.
High Rel products maximum Manual reflow temperature, storage condition and board assembly conditions have been updated
3D PLUS all Hi-Rel products will not mark Module Options any longer at the end of the marking.
3D PLUS standardizes the Tantalum Shielding Option with a unique Thickness - 250micro-meter.
3D PLUS replaces the 64Mx8b and 32Mx16b SDRAM basic devices embedded in its Space Qualified SDRAM Memory Modules.
17 SDRAM Modules in 3D PLUS product portfolio are replaced by new modules with same 512Mb basic device. 3D PLUS continues to provide the other Space qualified SDRAM from 512M to 4Gb Modules.
Qualification details for a new 4Gb FLASH NAND basic device embedded in our Space Qualified FLASH NAND Memory Modules
3D PLUS standardizes all industrial products marking for all products ordered after the 1st of February 2012.
It Standardizes the lead height for all Flash Nand and Flash Nor memory products.
The case of 3D PLUS catalog space qualified modules is systematically tied to the electrical Ground pin (GND) of the modules for modules with Date Code DC1145 or after.
3D PLUS replaces the fast SRAM basic device embedded in its Space Qualified SRAM Memory Modules.
Through the successful characterization and qualification of a new 4 Mb SRAM core device, 3D PLUS Space Qualified new SRAM Memory Modules are Function - Package - Footprint compatible with the existing modules and they exhibit further enhanced features compared to it.
Data retention results/curve for Hitachi HN58C/V1001 1M EEPROM are based on 3D PLUS test results and are calculated by help of the Arrhenius Rate Law
3D PLUS EEPROM Modules have been used to save critical data for space missions with years’ flight heritage. This document describes how to use RES pin to prevent unintentional programming to protect the critical data saved in the EEPROM Modules.
Introducing MRAM Modules Single Event Upset Immunity and test results
Use of 3DMR64M08VS4476 with 3D PLUS Latch-up Current Limiter Module
How to handle DDR2 Modules Unused Pins
3D PLUS patented technology allows our customers to replace an obsolete component by a pin-to-pin compatible System-In-Package (SiP) Stack.
Parallel EEPROM programming method is explained with the example of the 8 Mb EEPROM Stack referenced MMEE08001808SCC
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 16 years of flight heritage and 100 000 modules in Space