EN FR

Overview

Our Radiation Tolerant NOR Flash stacks are 3.3 V powered memories, featuring high density, high speed asynchronous parallel interface. They also offer no bad block, high endurance, long time data retention and x8b or x16b data bus width. They are offered in SOP package for high resistance Surface Mount (SMT) assembly and for withstanding harsh thermal and mechanical environments.

First released in 2008, 3D PLUS NOR Flash are the highest density space qualified NOR Flash. They are mainly used for small density Non Volatile Solid State Data Recorders and as processor boot and Program ROM in a variety of high performance computer boards. . These memory modules have been used on missions such as MSL, Insight, Mars 2020, EMM-Hope Probe, and others.

Key Features

  • Parallel access interface x 8 or x16

  • 20 years data retention

  • Small footprint

  • Radiation tolerance:

    TID > 20 krad (Si)

    SEL LETth > 51.2 MeV.cm²/mg

    SEU LETth > 10.0 MeV.cm²/mg;
    σsat = 1e-11 cm²/bit

  • Available in all 3D PLUS screening and qualification options:

    Commercial (C )

    Industrial (I)

    Space qualified (S)

  • Long life cycle products with proven reliability in Space

    No pure tin guarantee

    Large and worldwide flight heritage

Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The  screening level

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
 
Memory Part Number Decoder

Density Part Number Description Package Temperature
64 Mb 3DFO64M16VS1281 4M x16
90 ns access time
SOP 54 -55 °C to +125 °C
128 Mb 3DFO128M16VS2282 8M x16
90 ns access time
SOP 54 -55 °C to +125 °C
256 Mb 3DFO256M16VS4105 16M x16
90 ns access time
SOP 54 -55 °C to +125 °C
3DFO256M16VS4269 16M x16
90 ns access time
SOP 54 -55 °C to +125 °C
512 Mb 3DFO512M16VS8492 32M x16
90 ns access time
SOP 56 -55 °C to +125 °C
2 Gb 3DFO2G16VS4214 128M x16
100 ns access time
SOP 60 -55 °C to +125 °C
3DFO2G08VS4215 256M x8
110 ns access time
SOP 60 -55 °C to +125 °C

Design Tools

Design Tools

64 Mb

Assembly Recommendations PDF - 805 ko Download
Footprint PDF - 268 ko Download

128 Mb

Asembly Recommendations PDF - 805 ko Download
Footprint PDF - 271 ko Download

256 Mb

Assembly Recommendations PDF - 805 ko Download
Footprint PDF - 276 ko Download

512 Mb

Assembly Recommendations PDF - 805 ko Download
Footprint PDF - 271 ko Download

2 Gb

Assembly Recommendations PDF - 805 ko Download
Footprint PDF - 286 ko Download

Documentation

Density Part Number Flyer
64 Mb 3DFO64M16VS1281 Flyer PDF - 86ko Download
128 Mb 3DFO128M16VS2282 Flyer PDF - 86ko Download
256 Mb 3DFO256M16VS4105 Flyer PDF - 88ko Download
256 Mb 3DFO256M16VS4269 Flyer PDF - 87ko Download
512 Mb 3DFO512M16VS8492 Flyer PDF - 99ko Download
2 Gb 3DFO2G16VS4214 Flyer PDF - 891ko Download
2 Gb 3DFO2G08VS4215 Flyer PDF - 87ko Download