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Assembly Recommendations
These documents present the handling, storage and automatic reflow recommended conditions for the 3D stacked products and SiPs.
documents
- Handling, Storage, Manual Assembly Guidelines for SOP and BGA Modules
Manual Assembly, rework, coating, lead tinning recommendations
- Handling, Storage, Automatic Reflow Guidelines for SOP and BGA Modules
Convection, IR and Vapor Phase reflow profile recommendations
- Assembly Qualification report for Automatic Vapor Phase Reflow of Space qualified Memory Modules
The qualification flow includes cumulated shocks, vibrations and 500 Thermal Cycles
- Handling, Storage, Automatic Reflow Guidelines for RoHS BGA Modules
Stencil design rules and Vapor Phase reflow profile recommendations