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3D PLUS has more than 210,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
3D PLUS develops and manufactures miniaturized electronic modules for the space industry. Our technology enables stacking heterogeneous active, passive, and opto-electronic devices in a single highly miniaturized package. Our product range includes memory, computer cores, interfaces, power solutions, protection ICs, camera heads, camera systems, and custom SiP solutions. With over 220,000 components in space and more than 25 years of flight heritage, 3D PLUS serves the global space industry for various applications and it is expanding continuously with products launched in space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.
Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components. It responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications.
Benefiting from high Quality standards based on the ISO9001 certification, our 3D stacking technology is the sole worldwide qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications.
3D PLUS products are used in high technology industries such as aerospace, defense, security and avionics. With more than 220,000 modules in space, and more than 25 years of flight heritage with no reported failure, we provide the global space and defense industry for all types of applications: telecommunications, Earth observation, navigation, launch and manned space vehicles, science missions and constellations.
3D PLUS offers a wide range of catalog radiation tolerant products for space applications including Memories and IP cores, Computer Cores, Interfaces, POL converters, Protection ICs and Camera heads. Industrial memory and Custom System-In-Package (SiP) solutions are also available for our customers who want to shrink their design thanks to our State-of-the Art stacking technology and recognized design, manufacturing and test expertise.
High performance / high density / very high speed
High reliability / Rugged to extremely harsh environments and Space radiations
Extreme miniaturization / very small factor
Space qualification and very large flight heritage.
Long term availability
Capital :1,554,867
Incorporation date: October 1995 Shareholding structure: Subsidiary of the Electronics Technology Group of the HEICO Corporation (NYSE/HEI.A and HEI) Workforce: 250 employees
3D PLUS SA Registration: Versailles Trade & Companies Register N°. B 402 523 088 VAT N°: FR77402523088
3D PLUS USA Registration: Cage Code: 3FBQ6 DUNS: 109955232
Export Control:
3D PLUS complies with all applicable export control laws and regulations. 3D PLUS catalog products and SiPs technology are not subject to US-Export Regulations such EAR and ITAR; They Can be delivered worldwide.
For activities requesting exchange of projects’ information with its US customers, 3D PLUS USA Inc. and 3D PLUS SA comply with the regulations of the International Traffic in Arms Regulation for non-classified programs. All employees are trained and comply with the document and data controls required by ITAR. 3D PLUS empowered Official is available at 3D PLUS USA to answer any compliance questions you might have
408 Rue Hélène Boucher-Zi 78530 BUC, France PHONE : +33 (0) 130 832 650
1247 Reamwood Ave. Sunnyvale, CA, 94089 Phone (CA) : +1 510 824 5591 Phone (TX) : +1 972 672 2865 Phone (MD) : +1 410 274 5200
Foreign National visitors are requested to provide detail personal information for security clearance at least one week prior to their visit. In order to gain access to 3D PLUS site, each visitor will have to check in at the visitor’s front desk and present a valid ID for registration.
The visitor’s badge shall be worn visibly at all times. Overshoes for ESD protection and site cleanliness are delivered at the visitor’s front desk and shall be worn at all times while visiting our facility.
3D PLUS is a smoke-free facility. Smoking is only allowed outside the building in designated areas. The use of photo and video cameras is strictly forbidden while visiting 3D PLUS premises.
Located in the south of Paris, near Versailles, our headquarters are within driving distance of all major Paris Area Airports and can also be reached by public transportation.
In anticipation of your visit, a selection of hotels nearby 3D PLUS and more information on how to reach us is available in our welcome pack here.
