3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components.
3D PLUS standard products and System-In-Package (SiP) solutions are used in high technology industries for industrial, computer boards & embedded systems, defense & security, aircrafts & avionics, medical & sciences and aerospace applications.
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 20 years of flight heritage and 190,000 modules in Space