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3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
Temperature is one of the most severe constraints on electronic systems. In many industrial and aerospace environments, cooling is limited or impossible, and components must operate reliably while continuously exposed to heat that conventional electronics cannot tolerate. Memory components are particularly exposed: when they fail, data is lost. 3D PLUS addresses this challenge with its 64-Gb High Temperature NAND Flash, designed for applications where electronics face extreme thermal constraints.
NAND FLASH MEMORY3DFN64G08VB1388 HT
The 3D PLUS 64-Gb High Temperature NAND Flash (3DFN64G08VB1388) is a non-volatile memory housing two stacked chips, providing 64 Gb of storage capacity. Non-volatile memory retains data even when power is removed — an essential property for recording measurements and operating data in systems that must survive difficult conditions.
Latest tests confirmed the memory’s ability to withstand temperatures of up to 175°C. In environments where temperature is a major challenge for electronics, this capability makes the reliability of the memory module critical to overall system performance, as the chip embedded in the module meets the requirements of applications exposed to extreme thermal constraints.
Oil drilling is a demanding industrial application characterized by extreme environmental conditions. Equipment operates at depths of over 3000 metres, where it is exposed to very high temperatures — which can exceed 175°C or even 200°C — as well as high pressures, continuous vibrations, and a chemically aggressive environment.
In this context, embedded electronics play a key role in drilling management: real-time measurement of well parameters such as pressure, temperature, inclination and resistivity, and transmission of data to the surface. Non-volatile memories are meant to record data from various sensors — trajectory, orientation, pressure, temperature and others — which help determine the rock type or the stresses applied to the drill bit.
Component reliability is therefore essential to ensure continuous operations, avoid costly downtime, and maintain installation safety. Memory, processors and power circuits are particularly critical components: any failure can lead to data loss or drilling tool shutdown. Electronic systems for drilling need components that operate reliably at high temperatures with minimal performance drift. Oil drilling is thus a major use case for high-temperature electronics, requiring solutions specifically qualified and tested for harsh environments — and the 64-Gb High Temperature NAND Flash is an ideal solution for electronic boards on drilling platforms.
DOWNHOLE ELECTRONICS IN OIL & GAS DRILLINGElectronics placed at the harshest place on earth
Avionics systems installed near aircraft engines — such as engine control units, health monitoring systems and data acquisition modules — expose electronic memories to some of the harshest operating environments in the aerospace industry. Depending on their location within the nacelle or engine pylon, these systems may experience continuous temperatures above 125°C.
Under such conditions, conventional memory technologies can suffer from accelerated aging, increased leakage currents, reduced data retention, and degradation of packaging materials. Ensuring reliable storage of critical information becomes a major design challenge — all the more so because these memory devices often store engine control software, calibration parameters, maintenance records, fault histories and operational data. Any corruption or loss of information could affect aircraft availability, maintenance efficiency or, in critical cases, flight safety.
For this reason, avionics architectures typically incorporate error detection and correction (ECC), redundancy mechanisms, and continuous integrity monitoring. High-temperature memory capable of maintaining data integrity and long-term reliability under thermal, mechanical and environmental stress is therefore a key element of these hot-zone onboard systems, and the 3D PLUS solution meets the needs of avionics where cooling is limited or impossible.
AIRCRAFT ENGINE WITH FADEC (EEC)FULL AUTHORITY DIGITAL ENGINE CONTROL
Reliable non-volatile memory is a decisive factor in systems that must operate under severe thermal constraints. With its 64-Gb capacity, two stacked chips and confirmed ability to withstand temperatures up to 175°C, the 3D PLUS High Temperature NAND Flash addresses the needs of both drilling applications and hot-area avionics. It reflects the expertise 3D PLUS has built in developing electronic solutions for harsh environments.
3D PLUS NAND FLASH MEMORY3DFN64G08VB1388
