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3D PLUS has more than 220,000 microelectronics components in space, and more than 25 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
On 22 February 2024, Intuitive Machines’ Nova‑C lander “Odysseus” (mission IM‑1) performed the first U.S. soft landing on the Moon since Apollo 17 and the first by a commercial spacecraft. 3D PLUS contributed radiation‑tolerant NAND Flash and RTIMS (Radiation Tolerant Intelligent Memory Stack) memory modules that supported data storage and system operations during the mission.
This mission underlines the role of reliable space components in lunar exploration and sets a reference for future Moon missions under NASA’s Artemis campaign and CLPS contracts, as well as for ESA and defense programs.
Intuitive Machines-1 Lunar Landing
IM‑1 flew under NASA’s Commercial Lunar Payload Services (CLPS) initiative and supports the agency’s Artemis program to return humans to the Moon. The Odysseus lander carried six NASA instruments and several commercial and university payloads to the lunar south pole region.
Laser Retro‑Reflector Array (LRA) – passive optical target for future ranging.
Navigation Doppler Lidar (NDL) – used for velocity and range measurements during descent.
Lunar Node‑1 (LN‑1) – S‑band navigation demonstrator for autonomous positioning.
Radio Frequency Mass Gauge (RFMG) – propellant quantity measurement in tanks.
SCALPSS – stereo cameras to image engine plume interaction with regolith.
ROLSES – low‑frequency radio spectrometer for the lunar photoelectron sheath and radio environment.
Commercial and academic payloads included Embry‑Riddle’s EagleCam CubeSat, Louisiana State University’s Tiger Eye‑1 radiation monitor, the ILO‑X imager precursor, and Jeff Koons’ Moon Phases art installation.
3D PLUS supplied radiation‑tolerant NAND Flash and RTIMS modules on board Odysseus. These devices are designed for high‑radiation environments and are used for processor boot, program storage, FPGA bitstreams and mission data logging.
Key characteristics relevant to Moon missions and deep‑space missions:
Radiation tolerance – high resistance to Total Ionizing Dose (TID) and Single‑Event Effects (SEL, SEU, SEFI).
Non‑volatile storage – stable data retention for firmware, configuration and science data over long missions.
Compact, space‑qualified packages – suitable for tight mass and volume constraints on landers, orbiters and small satellites.
On IM‑1, 3D PLUS memory supported:
Reliable data storage for instrument data and housekeeping telemetry in a high‑radiation cislunar and lunar environment.
System initialization and reconfiguration, including FPGA and processor boot where non‑volatile, radiation‑tolerant memory is critical.
Data integrity from launch through lunar descent, landing and surface operations.
IM‑1 demonstrated that commercial landers can deliver NASA science to the lunar south pole region and operate a multi‑payload suite in a harsh environment. Reliable, radiation‑tolerant memory is a core enabling technology for such missions, where data loss or corruption can compromise navigation, science return and spacecraft safety.
3D PLUS continues to supply space‑qualified memory solutions for lunar and deep‑space missions, building on the IM‑1 heritage. The company’s radiation‑tolerant memories are positioned for future CLPS missions, Artemis landers, orbital platforms and surface systems that require dependable data storage in high‑radiation environments
