+
trigger

4 Megapixels CMOS Space Camera Head and IPs

Overview

The 4 Megapixels Space Camera Head is a high-resolution camera head for space applications. Integrated using 3D PLUS packaging technology, this cmera module embeds a 2048x2048 CMOS Image Sensor, associated with a user-reconfigurable FPGA-based electronic architecture, allowing configurable embedded image processing and formatting for a versatile use.

The 4 Megapixels Space Camera Head embeds all necessary components to operate the CMOS image sensor and the FPGA in highly constrained space environment (integrated DC-DC converters, Latch-up protection, processing and storage memory) in a reduced volume of 35x35x23mm3. This camera module offers a configurable electrical interface through a 55-pin PGA matrix, including 12 LVDS pairs, 13 general purpose IOs, a JTAG interface and a 5V to 9V input power supply. It also provides dedicated optical, mechanical, and thermal interface for an optimal and easy integration in its user's instrument.

This product is suitable to cover a wide range of applications, including scientific imaging, platform or payload monitoring, startracking or navigation application. 

The 4 Megapixels Space Camera Head has been selected in the scope of multiple missions, including NASA's Mars2020 program as a part of the SuperCam Instrument of the Perseverance rover, and benefits from flight heritage since 2019.

Key Features

4 Megapixels CMOS Image Sensor:

  • 2048 (H) * 2048 (V) active pixels on 5.5µm pitch
  • RGB or Monochrome
  • Read noise: 13 e-
  • FWC: > 11k e-
  • Dark Current < 125 e-/s
  • Spectral response: 400-1000 nm
  • Embedded image processing functions (subsampling, windowing)

User-configurable Flash-based FPGA (3M Logic Gates)

Embedded memories:

  • 1 Gbit SDRAM processing memory
  • 8 Gbit NAND Flash storage memory

Frame rate:

  • 16 frames/s @ full resolution in 10-bit mode
  • 7 frames/s @ full resolution in 12-bit mode

13 general purpose signals

10 LVDS output pairs and 2 LVDS input pairs

Radiation tolerance:

  • TID > 30 krad(Si)
  • SEL LET > 60 MeV.cm²/mg

Temperature range: -40°C to +70°C

35x35x23 mm3, Mass < 62 g

Space qualified technology

Worldwide delivery guarantee

Lineup

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVENESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 20 years of flight heritage and 190,000 modules in Space