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3D PLUS has more than 200,000 microelectronics components in space, and more than 20 years of flight heritage with no reported failure. Our Flight Heritage is expanding continuously with products launched in Space every month in LEO, MEO and GEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions in Europe, America, and Asia. Our Flagship missions include Mars 2020, Mars Science Laboratory, Rosetta, New Horizons, Juno, OneWeb, AlphaSat, Sentinel, Ariane 5, ISS, Parker Solar Probe, Insight, and many more.
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3D PLUS provides compact DDR3 modules including termination resistors and decoupling capacitors for applications requiring high-speed computing memory. Thanks to 3D PLUS proven stacking technology, DDR3 ruggedized modules offer high reliability in BGA packages for harsh environments.
Up to 32Gb Memory Density
Wide Data bus x8, x16, x32 and x72
Small form factor and low profile
Extended/Specific temperature range
Lead free or SnPb solderballs
Excellent signal Integrity and High Reliability
Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:
For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.
Memory Part Number Decoder
Other technical documentation is available under request: IBIS, RTL, Step and Mechanical file, Radiation Report.
