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  • INDUSTRY FIRST SPACE QUALIFIED DDR2

    INDUSTRY FIRST SPACE QUALIFIED DDR2

    72-bit Wide Data Bus,
    Embedded decoupling capacitors,
    Highly miniaturized,
    Radiation Tolerant - Space Qualified.

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  • WDoD™ - A UNIQUE PROCESS FOR 3D IC & WAFER LEVEL STACKS

    WDoD™ - A UNIQUE PROCESS FOR 3D IC & WAFER LEVEL STACKS

    Use of Different Die and Form Factors,
    More than 1 die per layer,
    Use of stadard Wafers without TSV,
    The only really available 3D IC process.

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  • CURIOSITY ROVER HAS LANDED ON MARS !

    CURIOSITY ROVER HAS LANDED ON MARS !

    Mars Science Laboratory - Curiosity
    Landed on Mars, Gale Crater
    on August 5th, 2012, 10H31 pm PDT.

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  • NEW PRODUCT

    NEW PRODUCT

    72-bit Wide Data Bus DDR-II Memory,
    -55/+125°C Temperature Range,
    Sn/Pb Balls.

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  • SPACE PRODUCT

    SPACE PRODUCT

    RAD HARD POL Converter
    1.2 to 4.5V Ouput Voltage - 5.5 Amps,
    High Efficiency,
    Compact Size - Low Weight,
    Available Off-The-Shelf.

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  • SOLID STATE DRIVE IN A 224-PBGA PACKAGE

    SOLID STATE DRIVE IN A 224-PBGA PACKAGE

    Highly Miniaturized,
    64 GB Memory Density,
    -55/+125°C Temperature Range,
    Sn/Pb Balls.

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  • SYSTEM-IN-PACKAGE – SiP

    SYSTEM-IN-PACKAGE – SiP

    A Unique Mix of Different Die and Form Factors,
    80% size and weight savings,
    Outperforms monolithic SoCs designs.

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  • OEM CAMERA HEAD - INDUSTRIAL AND MEDICAL APPLICATIONS

    OEM CAMERA HEAD - INDUSTRIAL AND MEDICAL APPLICATIONS

    Color CCD Image Sensor - 140 000 Pixels
    High sensitivity
    Highly miniaturized - 2.6 mm diameter
    Long cable driving capability
    Rugged for Harsh Environments

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Latest News

  • 3D PLUS displayed its new Products at DESIGN West 2013 - San Jose, CA, USA - 8 April 2013
  • 3D PLUS will display its new Rad Hard Products for Space Applications at NSREC 2013 (July 8-12th, San Francisco, USA) - 15 April 2013