Welcome to 3D Plus
3D Plus is a worldwide supplier of advanced high density 3D microelectronic products and Die Stacking technologies meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.
We offer catalog products and more complex System-In-Package (SiP) solutions that bring breakthrough advantages to our customers’ electronic designs.
We focus on the demand for high-reliability and high-performance for space-saving technology-driven applications in industrial, computing/telecommunications, security and defense, avionics, medical and space markets.
Product Highlights
Radiation Tolerant POL ConverterHigh performances, high reliability, compact size and low weight for Space DC/DC Converters
Memories for Industrial MarketA wide range of high density memories available in industrial and extended temperature range, dedicated to high reliability applications
System-In-Packages - SiPStacked SiPs enable solutions to merge heterogeneous Semiconductor devices and technologies together in a single highly miniaturized package
News
- Meet us at NSREC 2010 - IEEE Nuclear and Space Radiation Effects Conference (19/07/2010)
- Les TSV sont loin d etre la panacee pour les circuits 3D (06/06/2010)
- New Radiation Tolerant fast SRAM Memory Products family for Space Applications (02/04/2010)
- New DDR2 SDRAM Memory Family (20/10/2009)