Welcome to 3D Plus
3D Plus is a worldwide supplier of advanced high density 3D microelectronic products and Die Stacking technologies meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.
We offer catalog products and more complex System-In-Package (SiP) solutions that bring breakthrough advantages to our customers’ electronic designs.
We focus on the demand for high-reliability and high-performance for space-saving technology-driven applications in industrial, computing/telecommunications, security and defense, avionics, medical and space markets.
Product Highlights
Radiation Tolerant POL ConverterHigh performances, high reliability, compact size and low weight for Space DC/DC Converters
32 Gb NAND Flash for SpaceHigh density Radiation Tolerant memory available in -55/+125°C temp. range for Non Volatile and very low power Mass data storage
System-In-Packages - SiPStacked SiPs enable solutions to merge heterogeneous Semiconductor devices and technologies together in a single highly miniaturized package