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  • A NEW GENERATION OF EMBEDDED PROGRAMMABLE MODULES

    A NEW GENERATION OF EMBEDDED PROGRAMMABLE MODULES

    All-in-One fully tested System-In-Package,
    Highly Miniaturized 19 x 19 x 3.9 mm,
    -40 °C / +85°C Temperature Range.

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  • INDUSTRY FIRST SPACE QUALIFIED DDR2

    INDUSTRY FIRST SPACE QUALIFIED DDR2

    72-bit Wide Data Bus,
    Highly miniaturized, 
    Radiation Tolerant - Space Qualified.

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  • WDoD™ - A UNIQUE PROCESS FOR 3D IC & WAFER LEVEL STACKS

    WDoD™ - A UNIQUE PROCESS FOR 3D IC & WAFER LEVEL STACKS

    Use of Different Die and Form Factors, More than 1 die per layer,
    Use of stadard Wafers without TSV,
    The only really available 3D IC process.

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  • NEW PRODUCT

    NEW PRODUCT

    High Density DDR-III Memory Modules,
    -55/+125°C Temperature Range,
    RoHS and Sn/Pb Balls.

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  • ROSETTA COMPLETED THE COMETE RENDEZVOUS MANOEUVRE

    ROSETTA COMPLETED THE COMETE RENDEZVOUS MANOEUVRE

    The Orbiter starts to map the nucleus
    on August 2014.
    The landing is scheduled for November...

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  • SPACE PRODUCT

    SPACE PRODUCT

    RAD HARD POL Converter
    1.2 to 4.5V Ouput Voltage - 5.5 Amps,
    High Efficiency,
    Compact Size - Low Weight,
    Available Off-The-Shelf.

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  • SOLID STATE DRIVE IN A 224-PBGA PACKAGE

    SOLID STATE DRIVE IN A 224-PBGA PACKAGE

    Highly Miniaturized,
    64 GB Memory Density,
    -55/+125°C Temperature Range,
    Sn/Pb Balls.

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  • CURIOSITY ROVER HAS LANDED ON MARS !

    CURIOSITY ROVER HAS LANDED ON MARS !

    Mars Science Laboratory - Curiosity
    Landed on Mars, Gale Crater
    on August 5th, 2012, 10H31 pm PDT.

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  • SYSTEM-IN-PACKAGE – SiP

    SYSTEM-IN-PACKAGE – SiP

    A Unique Mix of Different Die and Form Factors,
    80% size and weight savings,
    Outperforms monolithic SoCs designs.

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  • OEM CAMERA HEAD - INDUSTRIAL AND MEDICAL APPLICATIONS

    OEM CAMERA HEAD - INDUSTRIAL AND MEDICAL APPLICATIONS

    Color CCD Image Sensor - 140 000 Pixels
    High sensitivity
    Highly miniaturized - 2.6 mm diameter
    Long cable driving capability
    Rugged for Harsh Environments

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Latest News

  • Meet us at the Enova 2014 exhibition, September 16th-18th, 2014, Paris, France (28/08/2014)
  • Visit us booth # 658 at MILCOM, October 6-8, 2014 at the Baltimore Convention Center, Baltimore, MD (15/09/2014)