CASPEX Camera Heads PRODUCT OVERVIEW 3D PLUS CASPEX CAmera for SPace EXploration Camera Heads offer high density high performance and high resolution imaging solutions for space applications CASPEX solutions combine a high- resolution image sensor with a FPGA-based electronic architecture integrating sensor control and interfacing and image processing Power supplies memories and protections are integrated into this miniaturized module to meet the constraints of space platforms and instruments Spectral response for CASPEX 4 Mpx Spectral response for CASPEX 12 Mpx Spectral response for CASPEX 1.3
Mpx SWIR KEY FEATURES Highly integrated all-in-one optoelectronic core Generic User-reconfigurable FPGA-based architecture with available Standard FPGA designs and IP cores Embedded processing and storage memories Embedded power supplies and protections Radiation hardened by design KEY BENEFITS Reduced development time with standardized off-the-shelf and turn-key solutions High versatility and adaptability with user-reconfigurable FPGA-based architectures Mass and space saving with high degree on integration of all-in-one solutions Easy optics centering focal plan alignment and system to dedicated optical/mechanical thanks integration references Enhanced mission reliability with fully qualified products and more than 20 years of 3D PLUS experience designing camera heads APPLICATIONS Earth observation planetology Platform monitoring equipment payload target GNC sensor tracking RdV Star-tracking Spectroscopy 28