About 3d plus world-leading supplier of advanced high-density 3d microelectronic products
ABOUT 3D PLUS COMPANY OVERVIEW 3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and die/wafer stacking technology Our products meet the demand for high reliability high performance and very small size of today's and tomorrow's electronics Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes It enables stacking heterogeneous active passive and opto-electronic devices in a single highly miniaturized package Comparing to other existing 2D traditional solutions our technology allows gaining a factor of at least 10 on the weight and volume 3D PLUS standard products and System-In-Package SiP solutions bring breakthrough advantages to our customers' electronic designs They are used in diverse computer boards data recorders boards and custom applications for buses and payloads Our Flight Heritage is expanding continuously with products launched in Space every month in GEO MEO and LEO orbits for deep space exploration missions for satellite constellation fleets and for governmental missions Since our creation in 1995 we have been pursuing a constant growth with today customers spread over 30 countries 3D PLUS MAIN BENEFITS RADIATION EXPERTISE A strong space radiation expertise for high reliability products MINIATURIZATION Size reduction for the PCB and weight savings for the application HIGH RELIABILITY Proven technology combined with a unique design and manufacturing know-how developed for more than 20 years 2