<article class="subdiv"> <header id="titre" class="subdiv"> <h1>Space grade configuration memory boot manager (combo)</h1> </header> <div id="pdfdata" class="subdiv"> <div style="display:inline-block;width:20%;"> <a href="https://it4v7.interactiv-doc.fr/html/catalogue_3d_plus_1126/rna/page/14"><img style="width:100%;" src="./thumbs/14.jpg"></a> </div> </div> <nav id="breadcrumb"> <p>Vous êtes ici : </p> </nav> <main> <p>COnfiguration Memory BOot manager COMBO PRODUCT OVERVIEW 3DCO0849 SCD# 3DPA-8335 COMBO is a space grade configuration memory boot manager to configure SRAM based FPGAs requiring a large configuration memory 3D PLUS's COMBO module provides a unique solution that combines all required hardware resources into a single module to boot the SRAM based FPGA in the smallest PCB footprint available in the market COMBO is an all-in one smart space grade solution performing the following functions Integrating a 16 Gbit RT NAND Flash capable of storing multiple large configuration images for the FPGAs and their embedded processors Mitigating the different bitstreams against radiation effects Booting the SRAM based FPGA from the required configuration image stored in the NAND Flash Providing file protection Supporting functionality to detect the errors of the SRAM based FPGA when needed Allowing the in-flight reconfiguration of the bitstream Allowing persistent file storage if needed Supporting AMD Versal KEY FEATURES COMBO is a turnkey solution compatible with SRAM FPGAs to Safely boot the SRAM-based FPGA requiring large configuration memory Monitor the SRAM based FPGA when needed KEY BENEFITS High density full space grade solution to boot high end SRAM based FPGAs Multiple reliable bitstream images management with data integrity Enhance system's reliability by monitoring SRAM base FPGAs Key solution for on-orbit reconfiguration Smallest footprint on PCB Time and money savings INTERFACES For user ground support to store bitstreams and configuration files SPI Ground Support interface Bandwidth up to 58 Mbps Quad For in-flight use to boot SRAM FPGAs and MPSoCs SPI Boot interface Bandwidth up to 116 Mbps Dual Quad For in-flight use to Read and Write R&W bitstreams/files SPI R&W interface Bandwidth up to 58 Mbps Quad RADIATION TOLERANCE TID 50 krad SEL LET 62.5 </p><p>MeV.cm²/mg </p><p>MODULE CONFIGURATION Power Supply 1.2 </p><p>V 2.5 </p><p>V 3.3 </p><p>V 483 BGA pins module BGA pitch = 1.27 </p><p>mm ENVIRONMENT PERFORMANCES -40 °C to +105 °C 14 </p> </main> <aside> <ul> <li><a href='https://www.3d-plus.com/space-catalog/'>Space Products Catalog- 3D PLUS</a></li> </ul> </aside> <footer> <table width="100%"> <tr> <td width="100%"><a href="http://www.interactiv-technologies.com/interactiv-doc">Interactiv' Doc</a></td> </tr> </table> <ul> <li><a href="./sitemap.html">Plan du site</a></li> </ul> </footer> </article>