<article class="subdiv"> <header id="titre" class="subdiv"> <h1>3d plus rad-hard space volatile memories</h1> </header> <div id="pdfdata" class="subdiv"> <div style="display:inline-block;width:20%;"> <a href="https://it4v7.interactiv-doc.fr/html/catalogue_3d_plus_1126/rna/page/12"><img style="width:100%;" src="./thumbs/12.jpg"></a> </div> </div> <nav id="breadcrumb"> <p>Vous êtes ici : </p> </nav> <main> <p>VOLATILE MEMORIES ACCESS /CLOCK VOLTAGE V DENSITY CONFIG DDR4 RADIATION TOLERANCE TID(1 krad Si SEL(1 MeV.cm²/mg </p><p>SEU MeV.cm²/mg </p><p>SEU Xsection(2 cm²/bit 4x10-12 3 4x10-12 3 6x10-12 3 6x10-12 3 6x10-12 3 16 Gbit 256M x 72 3D4D16G72LB2832 3D4D24G48LB2833 24 Gbit 512M x 48 3D4D32G72LB2805 32 Gbit 512M x 72 3D4D48G48LB2825 48 Gbit 1G x 48 3D4D64G80LB2860 64 Gbit 1G x 80 1.2 </p><p>1.2 </p><p>1.2 </p><p>1.2 </p><p>1.2 </p><p>62.8 </p><p>62.8 </p><p>62.8 </p><p>62.8 </p><p>62.8 </p><p>100 100 100 100 100 1200 MHz 1200 MHz 1200 MHz 1200 MHz 1200 MHz 2.6 </p><p>2.6 </p><p>2.6 </p><p>2.6 </p><p>2.6 </p><p>PACKAGE SCD# BGA 259 3DPA-8252 BGA 259 3DPA-8256 BGA 259 3DPA-8260 BGA 259 3DPA-8246 BGA 363 3DPA-8294 Temperature C I S Specific temperature range -55 C to +105 C VOLTAGE V ACCESS /CLOCK DENSITY CONFIG DDR3 RADIATION TOLERANCE PACKAGE SCD# SEU Xsection(2 cm²/bit SEU MeV.cm²/mg </p><p>SEL(1 MeV.cm²/mg </p><p>TID(1 krad Si 1.05x10-11 </p><p>1.05x10-11 </p><p>1.05x10-11 </p><p>BGA 95 3DPA-8172 BGA 199 3DPA-8173 BGA 259 3DPA-8250 0.4 </p><p>0.4 </p><p>0.4 </p><p>67 67 67 75 75 75 1.35 </p><p>or 1.5 </p><p>667 MHz 1G x 16 3D3D16G16YB4751 16 Gbit 256M x 72 1.35 </p><p>or 1.5 </p><p>3D3D16G72WB2723 16 Gbit 667 MHz 512M x 48 1.35 </p><p>or 1.5 </p><p>667 MHz 3D3D24G48YB2732 24 Gbit Temperature C I S Specific temperature range -40 C to +105 C ACCESS /CLOCK VOLTAGE V DENSITY CONFIG DDR2 RADIATION TOLERANCE TID(1 krad Si SEL(1 MeV.cm²/mg </p><p>SEU Xsection(2 cm²/bit SEU MeV.cm²/mg </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>5.6x10-11 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>2.3 </p><p>125-333 MHz 125-333 MHz 125-333 MHz 125-333 MHz 125-333 MHz 125-333 MHz 125-333 MHz 125-200 MHz 100 100 100 100 100 100 100 100 1.8 </p><p>1.8 </p><p>1.8 </p><p>1.8 </p><p>1.8 </p><p>1.8 </p><p>1.8 </p><p>1.8 </p><p>68 68 68 68 68 68 68 68 3D2D1G08US1285 3D2D2G08US2662 3D2D2G16UB2684 3D2D4G08US4661 3D2D4G72UB3652 3D2D6G48UB3687 3D2D6G48UQ3694 3D2D8G08US8663 1 Gbit 2 Gbit 2 Gbit 4 Gbit 4 Gbit 6 Gbit 6 Gbit 8 Gbit 128M x 8 256M x 8 128M x 16 512M x 8 64M x 72 128M x 48 128M x 48 1G x 8 PACKAGE SCD# SOP 74 3DPA-8186 SOP 74 3DPA-8187 BGA 95 3DPA-8188 SOP 74 3DPA-8189 BGA 191 3DPA-8201 BGA 143 3DPA-8190 QFP 144 3DPA-8191 SOP 88 3DPA-8192 Temperature C I S Specific temperature range -40 C to +105 C DESCRIPTION TARGET FPGAs P/N 4 IP CORES RIMC DDR2 3DIPMC0700 RIMC DDR3 3DIPMC0744 RIMC DDR4 3DIPMC0815 Xilinx V5QV Series 7 Microchip RTG4 Xilinx Series 7 Ultrascale Microchip Polarfire Xilinx Ultrascale Ultrascale+ Configurable high performing DDR controller mitigating radiation effects to increase memories protection Memories SEU and SEFI enhanced protection ECC scrubbing user definable Reed Solomon 2 symbols 4 symbols 1 Minimum values 2 SEU saturated cross section 3DIPEC0725 3DIPEC0726 Reed Solomon Encoding and Decoding IP Core to provide protection for data storage in space application 3 Including SBUs from SEFI 4 Refer to P/N Decoder 3DPI-0190-2 12 </p> </main> <aside> <ul> <li><a href='https://www.3d-plus.com/space-catalog/'>Space Products Catalog- 3D PLUS</a></li> </ul> </aside> <footer> <table width="100%"> <tr> <td width="100%"><a href="http://www.interactiv-technologies.com/interactiv-doc">Interactiv' Doc</a></td> </tr> </table> <ul> <li><a href="./sitemap.html">Plan du site</a></li> </ul> </footer> </article>