Quality Grades & Reliability

Quality Grades

The available Quality Grades are defined in 3D PLUS Process Identification Document. The Quality Grade of a product is a combination of a temperature range and a screening level.

The available temperature ranges are:

  • C: 0 °C / 70 °C
  • I: - 40 °C / + 85 °C
  • M: - 55 °C / + 125 °C
  • S: Specific on customer's demand

The available screening levels are:

  • N: Commercial
  • B: Industrial
  • S: Space (as per European Space Agency qualification)

The combinations of « Temperature Range » and « Screening level » allow serving a broad range of applications and customers’ requirements. For Space applications, «-IB» Quality Grade is used for Engineering Models and «-IS» or «-MS» Quality Grade are used for Flight Models.

Screening Level Description

The screening flow depends on the stacking technology flow used: Standard Packages stacking (Flow 1) or Flex stacking (Flow 2).
In space terminology, Engineering Models (EM) correspond to the Industrial level and Flight Models (FM) correspond to the Space level.
It shall be noted that this standard screening level can be amended through a detail specification / source control drawing.

Technology Steps & operations Screening level
Flow 1 Flow 2   Commercial Industrial Space
Applicable documentation
Process Identification Document (PID)
Module test specification
Module detail specification / Source Control Drawing
Procurement and Element Evaluation for EEE Parts, Mechanical Parts and Materials
Components and Materials lots traceability
Components and Materials Lot Acceptance Test (LAT)
Radiation Lot Acceptance Test (RLAT) (7)
Modules manufacturing
Manufacturing traceability for each module lot
Flex assembly according to PID
Electrical test at +25°C – Go / NoGo (3) (3)
Burn-in flex 168hrs +125°C followed by an electrical test at +25°C – Go / NoGo (2)
Flex Precap visual inspection before stacking
Module Manufacturing according to the PID
Electrical test at +25°C – Go / NoGo
Modules screening
Stab. Bake 72hrs +125°C
Thermal cycles (x10) –55°C/+125°C
Electrical test at +25°C pre burn-in with R&R
Burn-in 240hrs / +125°C
Electrical test at Tmin, +25°C, Tmax, (6) (Go/NoGo) (R&R)
Parameters drift calculation at +25°C
P.D.A. calculation (4)
Final external visual inspection
Dimensions measurements (3 modules)
Modules serialization (1)
Module Lot Acceptance Test - (7)
Life test 1000hrs / +125°C
Electrical test at Tmin, +25°C, Tmax, Post life test with R&R – (6)
Parameters drift calculation à +25°C
Final external visual inspection
Final DPA (1 module)
Quality Assurance
Customer source inspection
Documentation delivered Delivery Note Delivery Note + CoC Delivery Note + EIDP (8)

(1) If option 1 is selected, modules are serialized and components lots traceability is kept through the flow.
(2) If option 2 is selected, a 168hrs burn-in is performed for each flex. Therefore, the module burn-in duration may be reduced to 96 hrs.
(3) If option 3 is selected, each flex is electrically tested.
(4) PDA calculation is in accordance with ECSS-Q-ST-60-05C:
- For Parametric Drift failure, if the number of failed modules exceeds 5% of the number of modules submitted to burn-in and electrical measurements the lot shall be rejected.
- If the cumulative total of Parameter Drift Failures and Parameter Limit Failures exceeds 10% of the number of modules submitted to burn-in and electrical measurements, the lot shall be rejected.
(5) Modules LAT sample according to ECSS-Q-ST-60-05C:

Module lot size Sample 1e lot Sample next lots
1 to 25 2 1
26 to 50 3 2
51 to 90 4 3
> 90 5 4

(6) Unless otherwise specified, electrical test temperatures are: Tmin=-55°C and Tmax=+125°C
(7) Generic radiation tests reports are available for every catalogue product. Lot specific radiation tests are performed on demand for a specific product batch.
(8) The End Item Data Package (EIDP) includes all the traceability information for the product (screening summary, embedded parts & materials references, detailed electrical tests results, LAT and DPA reports,).

Harsh Environment

3D PLUS modules are designed to support harsh environments proved by both environmental and mechanical tests.
The table below lists some tests successfully withstood by 3D PLUS modules.

Stress Conditions Test method
Thermal Cycling
Extended Thermal Cycles 500cycles -55° to 125°C MIL-STD-883 M1010 Cond.B
Extended Thermal Cycles 500cycles -65° to 150°C MIL-STD-883 M1010 Cond.C
Thermal Cycles under vacuum 10^-6 torr
10 cycles -40°C/+70°C
Temperature storage
Low Temp Storage -130°C Specific
High Temp Storage 2000hrs / 150°C MIL-STD-883 M1008
High Temp Operating under pressure 1000hrs / 150°C / 1000bars Specific
Endurance Testing
Dynamic Life Test 2000hrs / +125°C MIL-STD-883 M1015
Power Cycling 30K cycles on/off
120s on (+110°C)
60s off (+40°C)
Resistance to Humidity
THB Test 1000hrs +85°C/85%RH MIL-STD-202 M103
HAST 264hrs / +110°C JEDEC STD 22TMA110
Salt Atmosphere
(industrial varnished modules)
24hrs MIL-STD-883 M1009 Cond.
AJESD22-A107-A Cond.A
Mechanical Resistance
Mechanical shock Y1 / 0.5ms / 1500g MIL-STD-883 M2002 Cond.B
Peak Acceleration 40 000g Specific
Sine Vibrations 20Hz – 2000Hz
Peak acceleration 20g/3axes
MIL-STD-883 M2007 Cond.A
Random Vibrations // to mating plane 30g/15min
To mating plane 30g/15min
MIL-STD-883 M2026 Cond.I
Level H/J
Outgassing TML & RML <1%
CVCM <0.1%
ESA-PSS-01-702 MA
Packaging Tests
Lead Integrity MIL-STD-883 M2004
Solderability MIL-STD-883 M2003
Marking permanency MIL-STD-883 M2015
Electrical Sensitivity Discharge
ESD Human Body Model ESD JS001-2014


Module Quality Classification Levels

3DPA-0850-4 Module Quality Classification Levels


Inventor of 3D stacked Electronics for Space


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Rugged components able to withstand harsh environments and space radiation effects


Dense, fast, rad hardened, System in Packages, miniaturized


Over 20 years of flight heritage and 190,000 modules in Space