3D PLUS offers a full lineup of radiation tolerant products including memories, POL converters, interfaces, peripherals and protection ICs , industrial memories, Solid-State drives, camera heads and more complex System-In-Package (SiP) solutions.
Our State-of-the Art stacking technology and recognized design, manufacturing and test expertise are the foundation and the strength of 3D PLUS Products, and, they bring breakthrough advantages to our customers’ electronic designs:
- High performance / high density / very high speed / excellent signal integrity
- High reliability / Rugged to extremely harsh environments and Space radiations
- Extreme miniaturization / very small form factor
- Space qualification and very large flight heritage
Our catalog products and SiP solutions respond to a diverse range of needs and meet the requirements of the most demanding applications in the industrial, computing/telecom., security and defense, avionics, medical and space markets.
Radiation Tolerant Computer Core
Our Radiation Tolerant computer core portfolio is starting with FUSIO RT family. Our computer cores are recognized for their high computational capability, high reliability and small form factor. They provide a reprogrammable Space grade FPGA and high reliable embedded memories in one single miniaturized package.
Radiation Tolerant Memory
Recognized for their high density, high speed, high reliability and Radiation Tolerance and their smallest form factors, our Space Qualified Memory include fast SRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM, PROM, EEPROM, MRAM and FLASH.
Radiation Tolerant Memory IP
DDR2, DDR3 and DDR4 radiation intelligent memory controller IP core are designed to work with 3D PLUS SDRAM DDR memory modules to provide a Radiation hardened solution. These fully configurable memory controller IP cores offer different types of ECC to support 8b to 128b data width applications. They provide SEU mitigation and SEFI protection, which are transparent to the users.
Radiation Tolerant Interfaces
Our products portfolio includes high reliability and highly miniaturized radiation tolerant LVDS line drivers and receivers and other interfaces and buffers that enable the maximum area and weight savings for the space applications boards’ designs.
Radiation Tolerant POL Converters
Radiation Hardened by design, our Space qualified Point-Of-Load DC/DC Converter provides a single and adjustable output voltage with a very high efficiency and excellent dynamic performances required by the fast and low voltage digital electronics (FPGAs, DDR and DDR2 SDRAM Memories).
Radiation Tolerant Peripherals and Protection ICs
Our products portfolio includes Radiation Hardened by Design Voltages References, Overvoltage Protection and Latch-Up Protection modules to improve the reliability and safety of the space designs. Thus, it enables the use in a space environment of high performances semiconductor devices not supported by Rad Hard foundries.
Radiation Tolerant Camera Heads
3D PLUS has developed an advanced CMOS camera for space applications. CMOS technology has been chosen due to its high integration level, low power consumption and excellent behavior in harsh environments. The bottom of the camera contains a PGA array where a flex can be connected to ensure the link to the system.
Our Industrial Memory Stacks include a lineup of high density and wide data bus (72-bit) DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM, SRAM and FLASH memories. Available in extended temperature ranges, they enable today the next generation of memory density for the high-reliability and space-saving technology-driven applications.
Industrial Solid State Drives (SSD)
3D PLUS Micro SSD are the solution of choice to integrate advanced data storage capabilities on embedded electronic systems without compromising on miniaturization and reliability under harsh environment. Modules are available in Industrial and Military temperature range.
Embedded Programmable modules
3D PLUS embedded programmable modules are the result of decades of innovation in 3D. This solution is integrating a complete sub-system (FPGA, Boot memory, volatile memory and passives) while remaining in the same form factor as a single component.
The FUSIO family is providing a generic fully validated backbone, ready to implement in mission critical boards.
Micro Camera Heads
Our product portfolio includes highly miniaturized 1/6” and 1/10”CCD camera heads as well a new CMOS solutions. Thanks to their embedded electronics which enable long cables driving capability with excellent signal integrity, our micro camera heads are widely used for video endoscopes applications where high quality images are required.
3D PLUS provides a one-stop source for concept analysis, design, manufacturing and test of custom System in Package (SiP). Achieving a combination that cannot be realized with monolithic SoCs, and, relying on a proven “first time right” design methodology, 3D PLUS SiP stacks are more effective and have a lower development cost and a faster time to market.
Inventor of 3D stacked Electronics for Space
High Quality referential with ISO and Space Agencies Certifications
Our support teams are everywhere you are to ensure your satisfaction
Rugged components able to withstand harsh environments and space radiation effects
Dense, fast, rad hardened, System in Packages, miniaturized
Over 20 years of flight heritage and 190,000 modules in Space