3D PLUS industrial standard products and SiPs are used in various applications where their capability to enable today the next generation of memory density and to bring ultimate area savings are key success factors. They are also ideally suited for applications such as oil drilling or automotive where operating with reliability under very harsh environments (high temperature, thermal cycles, vibrations and shocks) is a must.

For the most demanding application, our highly miniaturized and versatile SiPs enable achieving a combination that cannot be realized with monolithic SoC approaches, and it has a lower development cost and a faster time to market.

3D PLUS adaptable and cost-optimized supply chain is sized to achieve a fast time-to-market for the new products and to meet diverse ramp-up and mass manufacturing requirements.

Key benefits

  • Extreme miniaturization
  • Capability to merge heterogeneous component technologies (Die-Package-Passive) and functions (sensor, actuators, communication, processing, storage) in one single Package
  • Very high performance
  • Very High Reliability
  • Rugged to harsh environments (thermal, vibrations, shocks)
  • Guarantee of using genuine electronics products
  • Long term availability

Application fields

  • Automation and Computers
  • Metering systems
  • Imaging systems
  • Data acquisition
  • Test and measurement
  • Equipment and machine control
  • Rail systems and train control
  • Sensors and actuators
  • Drilling systems electronics

Inventor of 3D stacked Electronics for Space


High Quality referential with ISO and Space Agencies Certifications


Our support teams are everywhere you are to ensure your satisfaction


Rugged components able to withstand harsh environments and space radiation effects


Dense, fast, rad hardened, System in Packages, miniaturized


Over 20 years of flight heritage and 190,000 modules in Space