Standard Packages Stack

Overview

This process flow has the capability to stack n-High any standard package from the industry. It delivers small form factors, high reliability and a very high resistance to harsh environments. It was developed and patented by 3D Plus to enable stack solutions even when die are not available or too expensive to procure and test. Mainly used with TSOP packages for diverse memory stacks, this standard package stack technology can also be used with any SOT, Flat Pack or larger pin-count PQFP packages.
The TSOPs stack capability domain is referenced as FLOW 1 and is qualified by European Space Agency (ESA) for Space applications.

A derivative technology with thinned package stack process flow was developed in the frame of internal and European R&D projects for High Integration Plastic Package in Package (HiPPiP). Based on the FLOW 1 concept and sharing the same Key features and benefits, it increases the capability of FLOW 1 for very thin stacks. It is referenced as FLOW 2.5 or HiPPiP process.

FLOW 1 Process Flow Chart

Key Features Benefits
The components are stacked up Small form factor, Size reduction on the PCB, weight savings
The standard packaged components have been tested before stacking Stacking of n levels with excellent yield
The components are fixed into resin High mechanical resistance, resistance to harsh environments
Humidity resistance enhancement
The interconnection is reduced and simplified Higher electrical performance and signal integrity
Simplified PWB layout
The components can be shielded Considerable parasitic effect decrease
Use of well proven technologies Very High reliability
ESA Qualified Capability Domain for TSOPs stacks (PID 3300-0546) Stacks can be used intended for use in any ESA and other European spacecraft and Space segment hardware in accordance with the procurement requirements defined in the ECSS-Q-60-05A
Simplified Manufacturing processes Flexibility and short development time of new designs
Cost effectiveness
Stacks are connection independent Compatibility with all types of components insertion processes : SMT (Gull wing & BGA), Gluing (Conductive column T&B), Through Hole (PGA),…

FLOW 1 Products overview

  • Stack of 4 TSOPs with SOP I/Os
  • Stack of 4 QPF with PGA I/Os
  • Stack of 8 TSOPs with SOP I/Os
  • Stack of 8 TSOPs with BGA I/Os

FLOW 2.5 Products overview

  • Stack of 2 thinned µBGA packages with same thickness than original package