3D Stack - Road Maps

Road Maps for standard packages stacks, Die stacks and Wafer Level stacks based on “TPV” (Thru-Polymer Via) summarize 3D Plus present and future capabilities in terms of SiP stacks complexity, and overall form factors and level thickness.

641, rue Hélène Boucher - ZI
Buc Cedex - FRANCE
Phone: +33 (0)1 30 83 26 50
Fax: +33 (0)1 39 56 25 89
2570 Eldorado Parkway, Suite 150
McKinney, TX 75070 - USA
Phone: +1 (214) 733 8505
Fax: +1 (214) 733 8506