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Overview

The FUSIO RT family provides a reprogrammable Rad Hard By Design RHBD SRAM-based FPGA with high reliability embedded memories: a 128 Mbit TMR configuration memory, in addition to optional computing and data storage memories, all integrated in one single miniaturized package.

The FUSIO RT products are ideal for system applications requiring  performance, density and high reliability such as telecommunication satellites or experimental instruments.

Key features

  • Leading edge European reprogrammable FPGA ressources:

    • 263 users I/Os
    • 800 Mbps I/O support
    • 550k ASIC gates equivalent to 4 400 000 system gates
  • Modularity, upgradable computer core: one footprint for 4 configurations
    High level of miniaturization: 483 balls BGA, (32 x 32) mm² area

  • Enhanced radiation performances achieved by technology and by design:

    • TID > 40 krad (Si)
    • SEL LET > 60 MeV.cm²/mg
Line Up

Line Up

Each 3D PLUS standard product and SiP solution are defined by a specific part number based on the part number decoder provided below. The ordering information consist as a minimum of the following 3 items for fully define a product:

  • The product’s Part Number
  • The temperature range
  • The quality grade

For High Reliability products or SiPs for Aerospace applications, a Source Control Drawing (SCD#) referenced 3DPA-xxxx is available for each product. It shall be used for its procurement in addition to other ordering information.

 

Computer, Power and SiP Part Number Decoder

Product Part Number Description Package Temperature
FUSIO RT BASIC 3DMC0753 Space computer core with embedded RHBD FPGA NX1H35AS and 128Mb TMR Flash NOR 483 balls BGA

Pitch 1.27mm

-40 °C to +105 °C
FUSIO RT NAND 3DMC0754 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 64 Gb NAND Flash 483 balls BGA

Pitch 1.27mm

-40 °C to +105 °C
FUSIO RT SDRAM 3DMC0755 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 2 Gb SDRAM 483 balls BGA

Pitch 1.27mm

-40 °C to +105 °C
FUSIO RT FULL 3DMC0752 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR, 64 Gb NAND Flash and 2 Gb SDRAM 483 balls BGA

Pitch 1.27mm

-40 °C to +105 °C

 

Design Tools

Design Tools

FUSIO RT DEMO BOARD

Development boards for Fusio RT products

3DEV0753 : Development board for 3DMC0753 PDF - 1479 ko Download
3DEV0752 : Development board for 3DMC0752 PDF - 991 ko Download
3DEV0754 : Development board for 3DMC0754 PDF - 5845 ko Download
3DEV0755 : Development board for 3DMC0755 PDF - 993 ko Download
3DEV075X User Guide PDF - 2778 ko Download

Documentation

Product Part Number Flyer Data Sheet
FUSIO RT BASIC 3DMC0753 Flyer PDF - 1046ko Download Data Sheet PDF - 2769ko Download
FUSIO RT NAND 3DMC0754 Flyer PDF - 1095ko Download Data Sheet PDF - 4051ko Download
FUSIO RT SDRAM 3DMC0755 Flyer PDF - 1095ko Download Data Sheet PDF - 5418ko Download
FUSIO RT FULL 3DMC0752 Flyer PDF - 1032ko Download Data Sheet PDF - 6771ko Download