• Technical Support
• Radiation Assurance
• Application Notes
• Product Change Notices
• Electrical and Thermal Models
• Package Information
• Assembly Recommendations
• Quality Grades and Reliability
• Ordering Information
• How to buy
• Brochures
• White Papers
• Questions & Comments

Package Information

3D Plus products are available in a variety of packages and footprint. The different package type information and drawings are presented hereafter for download.

documents

• SOP 48 - A2 - 0.50 mm

  2-High stack - Small Outline Package footprint - 48 I/Os - 0.50 mm pitch

• SOP 48 - A4 - 0.50 mm

  4-High stack - Small Outline Package footprint - 48 I/Os - 0.50 mm pitch

• SOP 48 - A5 - 0.50 mm

  5-High stack - Small Outline Package footprint - 48 I/Os - 0.50 mm pitch

• SOP 54 - B2 - 0.80 mm

  2-High stack - Small Outline Package footprint - 54 I/Os - 0.80 mm pitch

• SOP 54 - B4 - 0.80 mm

  4-High stack - Small Outline Package footprint - 54 I/Os - 0.80 mm pitch

• SOP 54 - B8 - 0.80 mm

  8-High stack - Small Outline Package footprint - 54 I/Os - 0.80 mm pitch

• SOP 50 - C4 - 0.50 mm

  4-High stack - Small Outline Package footprint - 50 I/Os - 0.50 mm pitch

• BGA 79 - C4 - 1.27 mm

  4-High stack - BGA footprint - 79 I/Os - 8 x 10 matrix with 1.27 mm pitch

• SOP 50 - D8 - 0.50 mm

  8-High stack - Small Outline Package footprint - 50 I/Os - 0.50 mm pitch

• BGA 134 - E5 - 1.27 mm

  5-High stack - BGA footprint - 134 I/Os - 1.27 mm pitch

• SOP 58 - F8 - 0.80 mm

  8-High stack - Small Outline Package footprint - 58 I/Os - 0.80 mm pitch

• SOP 40 - G2 - 0.50 mm

  2-High stack - Small Outline Package footprint - 40 I/Os - 0.50 mm pitch

• SOP 40 - G4 - 0.50 mm

  4-High stack - Small Outline Package footprint - 40 I/Os - 0.50 mm pitch

• SOP 40 - G8 - 0.50 mm

  8-High stack - Small Outline Package footprint - 40 I/Os - 0.50 mm pitch

• SOP 64 - H2 - 0.80 mm

  2-High stack - Small Outline Package footprint - 64 I/Os - 0.80 mm pitch

• SOP 64 - H4 - 0.80 mm

  4-High stack - Small Outline Package footprint - 64 I/Os - 0.80 mm pitch

• SOP 64 - H8 - 0.80 mm

  8-High stack - Small Outline Package footprint - 64 I/Os - 0.80 mm pitch

• SOP 64 - J4 - 0.50 mm

  4-High stack - Small Outline Package footprint - 64 I/Os - 0.50 mm pitch

• SOP 64 - J5 - 0.50 mm

  5-High stack - Small Outline Package footprint - 64 I/Os - 0.50 mm pitch

• SOP 64 - J8 - 0.50 mm

  8-High stack - Small Outline Package footprint - 64 I/Os - 0.50 mm pitch

• SOP 54 - K4 - 0.50 mm

  4-High stack - Small Outline Package footprint - 54 I/Os - 0.50 mm pitch

• BGA 119 - S4 - 1.27 mm

  4-High stack - BGA footprint - 119 I/Os - 8 x 15 matrix with 1.27 mm pitch

• SOP 68 - V8 - 0.80 mm

  8-High stack - Small Outline Package footprint - 68 I/Os - 0.80 mm pitch

• SOP 44 - W4 - 0.80 mm

  4-High stack - Small Outline Package footprint - 44 I/Os - 0.80 mm pitch

• SOP 44 - W8 - 0.80 mm

  8-High stack - Small Outline Package footprint - 44 I/Os - 0.80 mm pitch

• SOP 70 - X2 - 0.635 mm

  2-High stack - Small Outline Package footprint - 70 I/Os - 0.635 mm pitch

• SOP 66 - Y2 - 0.65 mm

  2-High stack - Small Outline Package footprint - 66 I/Os - 0.65 mm pitch

• SOP 66 - Y4 - 0.65 mm

  4-High stack - Small Outline Package footprint - 66 I/Os - 0.65 mm pitch

• SOP 66 - Y8 - 0.65 mm

  8-High stack - Small Outline Package footprint - 66 I/Os - 0.65 mm pitch