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News & Press Releases

Welcome to 3D Plus News & Press Releases section where a variety of products and technology announcements as well as company information updates are presented.

• Meet us at NSREC 2010 - IEEE Nuclear and Space Radiation Effects Conference (19/07/2010)

  The conference will be held July 19 - 23 in Denver, USA.
  3D Plus team will welcome you on booth #20 during the Industrial Exhibit where we will showcase our new Radiation Tolerant Memory products (SRAM, SDRAM, DDR-I SDRAM, EEPROM, PROM, NAND Flash, Nor Flash, ....).

• Les TSV sont loin d etre la panacee pour les circuits 3D (06/06/2010)

  Le CEO de 3D Plus presente une approche plus pragmatique des circuits 3D qui consiste a suivre des regles simples: etre capable d'utiliser n'importe quel type de puces ou de wafer (multisourcing), savoir empiler plusieurs wafer bons les uns sur les autres, pouvoir utiliser des puces de dimensions et de technologie differentes. Ce sont ces regles qui sous tendent l'approche baptisee WDOD (Wirefree Die On Die), sans TSV ni interposeur, qui consiste a empiler des wafers reconstitues de 100 a 125 microns d'epaisseur et consideres comme bons (Known Good Rebuilt Wafer).

• New Radiation Tolerant fast SRAM Memory Products family for Space Applications (02/04/2010)

  3D Plus new Space Qualified SRAM Memory Modules feature 12ns access time over the -55/+125C temperature range and an improved Radiation performance (100 Krad(Si) TID and Latch-up immune to 110 Mev.cm2/mg).
  They are available worldwide with a very small package size brought by the Space Qualified 3D stacking technology of 3D Plus.

• Visit us in Embedded World 2010 (02/03/2010)

  We will be pleased to welcome you at booth 540 in Hall 12.0. During this special event we will display our latest industrial products.
  Nuremberg (Germany), March 2010, 2-4th

• HAPPY NEW YEAR 2010 (01/01/2010)

  Our Best Wishes for the New Year

• New DDR2 SDRAM Memory Family (20/10/2009)

  With density of 4Gb to 8Gb and x4, x8 or x16 organization, our standard Industrial DDR2 SDRAM are available with Extended temperature range and Tin Lead solderballs.

• MAPLD 2009 (Military and Aerospace Programmable Logic Devices) (31/08/2009)

  New products will be displayed during the 2-days industrial exhibition held at the NASA Goddard Space Flight Center in Greenbelt (MA) the week of August 31 - September 3, 2009.

• Successful renewal of 3D PLUS ISO 9001/2000 Certification (04/05/2009)

  Renewal of the ISO 9001:2000 Certification for the Design, Manufacturing, test and sales of 3D stacked microelectronics modules until November 2010

• Radiation Tolerant Memory stacks in NASA Kepler Telescope (02/03/2009)

  NASA Kepler Telescope mission embedding Radiation Tolerant Memory stacks will be launched abroad a Delta-II Rocket on Friday, March 6, from Pad 17-B at Cape Canaveral.

• Renewal of ESA/CNES Capability Approval Certification (27/02/2009)

  3D Plus Capability Approval for Space Applications has been successfully renewed by European Space Agency (ESA) until January 2011.

• CMSE (Components for Military & Space Electronics) (12/02/2009)

  New products will be displayed during the 2-days industrial exhibition in Sheraton San Diego San Diego,CA

• New Part Number Decoder for Memory Stacks (12/11/2008)

  Memory stacks labelling and marking are modified according to a new part number decoder. PCN and cross reference table are available for detailed information.

• Introduction of 3D Plus Radiation Tolerant Memory Stacks in the European Space Agency EPPL (20/11/2007)

  SDRAM, SRAM and EEPROM Radiation Tolerant Memory Stacks are introduced in the Issue 11 of the European Space Agency's Prefered Parts List ( ESA EPPL) for Space Applications

• 3D Plus received the 2007 EUREKA Lynx Award (01/06/2007)

  This trophy awards the highly successful EUREKA WALPACK project, which developed high-density, 3D chip-stacking technology for cost-effective system-in-package devices.

• Announcement of strategic partnership with BAE Systems (21/03/2007)

  3D Plus transfered 3D modules' design capability to BAE Systems for its next generation 3D electronics packaging for avionics, automotive, medical or consumer electronics