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News & Press Releases
Welcome to 3D Plus News & Press Releases section where a variety of products and technology announcements as well as company information updates are presented.
- HAPPY NEW YEAR 2010 (01/01/2010)
Our Best Wishes for the New Year
- Visit us in Embedded World 2010 (08/12/2009)
We will be pleased to welcome you at booth 540 in Hall 12.0
During this special event we will display our latest industrial products.
Nuremberg (Germany)
2-4, March 2010
- New DDR2 SDRAM Memory Family (20/10/2009)
With density of 4Gb to 8Gb and x4, x8 or x16 organization, our standard Industrial DDR2 SDRAM are available with Extended temperature range and Tin Lead solderballs.
- MAPLD 2009 (Military and Aerospace Programmable Logic Devices) (31/08/2009)
New products will be displayed during the 2-days industrial exhibition held at the NASA Goddard Space Flight Center in Greenbelt (MA) the week of August 31 - September 3, 2009.
- Successful renewal of 3D PLUS ISO 9001/2000 Certification (04/05/2009)
Renewal of the ISO 9001:2000 Certification for the Design, Manufacturing, test and sales of 3D stacked microelectronics modules until November 2010
- Radiation Tolerant Memory stacks in NASA Kepler Telescope (02/03/2009)
NASA Kepler Telescope mission embedding Radiation Tolerant Memory stacks will be launched abroad a Delta-II Rocket on Friday, March 6, from Pad 17-B at Cape Canaveral.
- Renewal of ESA/CNES Capability Approval Certification (27/02/2009)
3D Plus Capability Approval for Space Applications has been successfully renewed by European Space Agency (ESA) until January 2011.
- CMSE (Components for Military & Space Electronics) (12/02/2009)
New products will be displayed during the 2-days industrial exhibition in Sheraton San Diego San Diego,CA
- New Part Number Decoder for Memory Stacks (12/11/2008)
Memory stacks labelling and marking are modified according to a new part number decoder. PCN and cross reference table are available for detailed information.
- Introduction of 3D Plus Radiation Tolerant Memory Stacks in the European Space Agency EPPL (20/11/2007)
SDRAM, SRAM and EEPROM Radiation Tolerant Memory Stacks are introduced in the Issue 11 of the European Space Agency's Prefered Parts List ( ESA EPPL) for Space Applications
- 3D Plus received the 2007 EUREKA Lynx Award (01/06/2007)
This trophy awards the highly successful EUREKA WALPACK project, which developed high-density, 3D chip-stacking technology for cost-effective system-in-package devices.
- Announcement of strategic partnership with BAE Systems (21/03/2007)
3D Plus transfered 3D modules' design capability to BAE Systems for its next generation 3D electronics packaging for avionics, automotive, medical or consumer electronics