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Documentation

QUALITY HANDBOOK

Quality Handbook 2016

3DPQ-0340-1 Quality Handbook 2016

ASSEMBLY & HANDLING GUIDE

Assembly and storage recommendation - Manual Assembly EN

3300-1300-7 Manual Assembly recommendations - SnPb soldering process 

Assembly and storage recommendation - Automatic Assembly EN

3300-1301-5 - Assembly recommendations SOP and QFP Package - SnPb soldering process

Assembly and storage recommendation - Automatic Assembly (BGA modules) EN

3300-8283-2 - Assembly recommendations BGA package Sn10Pb90 solder balls  - SnPb soldering process

Assembly and storage recommendation - Automatic Assembly (BGA modules) CN

3300-8283-2 - Assembly recommendations BGA package Sn10Pb90 solder balls  - SnPb soldering process

Side Stacking of a SOP module

3641-0790-1 Side Stacking of a SOP module - Customer Support

Underfilling of a SOP module

3641-0841-2 Underfilling of a SOP module - Customer Support

Mechanical reinforcement of a BGA module EN

3641-0842-1 Mechanical reinforcement of a BGA module - Customer Support

Mechanical reinforcement of a BGA module CN

3641-0842-1 Mechanical reinforcement of a BGA module CN

Automatic assembly recommendations BGA packages_Industrial applications

3300-2794-3 EN Automatic assembly recommendations BGA packages_Industrial applications

PCN

Hi-Rel N/B grade marking change

The serial number will be marked on all quality grades modules N, B and S grades.

DDR3 4Gb marking update

3D PLUS is adding an additional marking information on Industrial DDR3 4Gb product family.

DDR1 Modules EOL and Replacement

Ends Of Life (EOL) all DDR1 SDRAM modules, which are based on x4 and x8b dice configurations, from the Space DDR1 SDRAM Memory portfolio

Nand Flash Modules Revision and EOL

New Space Qualified Nand Flash Modules with space qualified 2Gx8b (16Gb) Nand Flash basic devices for high performance and high density space designs.

Retinning materials changes to Sn91.5Sb8.5

Changing the material for the basic components retinning inside of the module from Sn96Ag4 to Sn91.5Sb8.5, and this only affect 3D PLUS Flow1 process modules

CCD Micro Camera Heads replacement

3D-PLUS is replacing its CCD micro-camera heads with new solutions based on CMOS technology

Release of DDR2 TR v2 - component replacement

3D PLUS releases the DDR2 Termination Regulator version 2 (3DPM0237-2). This new version replaces the 3DPM0237-1.

PoL 3DPM0024-3 EoL and component replacement

3DPM0024-3 PoL module will be replaced by the new 3DPM0211-1 PoL Converter which is fully compatible and no redesign is needed.

SRAMs 5V Basic Device Replacement Update

Following the successful qualification of the 5V fast SRAM basic device in 2011.
 3D Plus continues to introduce the New Space Qualified 5V SRAM Modules with this basic device to replace the existing modules.

1Gb DDR2 SDRAM Basic Device Replacement

3D Plus replaces the 1Gb DDR2 SDRAM basic devices embedded in its DDR2 SDRAM Memory Modules.

4Gb Nand Flash Basic Device Replacement

3D Plus replaces the 512Mx8b Nand Flash basic devices embedded in its Space Qualified Nand Flash Memory Modules.

High Rel Product Assembly Recommendation Update

High Rel products maximum Manual reflow temperature, storage condition and board assembly conditions have been updated

Module Options Marking Change

3D PLUS all Hi-Rel products will not mark Module Options any longer at the end of the marking.

Tantalum Shielding Thickness Change

3D Plus standardizes the Tantalum Shielding Option with a unique Thickness - 250micro-meter.

SDRAM Basic Device Replacement

3D Plus replaces the 64Mx8b and 32Mx16b SDRAM basic devices embedded in its Space Qualified SDRAM Memory Modules.

SDRAM Product Family upgrade

17 SDRAM Modules in 3D Plus product portfolio are replaced by new modules with same 512Mb basic device. 3D Plus continues to provide the other Space qualified SDRAM from 512M to 4Gb Modules.

Upgrade of NAND Flash Basic Device

Qualification details for a new 4Gb FLASH NAND basic device embedded in our Space Qualified FLASH NAND Memory Modules

Marking of Industrial Modules

3D Plus standardizes all industrial products marking for all products ordered after the 1st of February 2012.

New lead bending for the NAND and NOR Flash memory modules


 It Standardizes the lead height for all Flash Nand and Flash Nor memory products.

Modules’ Case connection to Ground (GND)

The case of 3D Plus catalog space qualified modules is systematically tied to the electrical Ground pin (GND) of the modules for modules with Date Code DC1145 or after.

SRAMs Basic Device Replacement - Introduction of a New fast SRAM Core Device

3D Plus replaces the fast SRAM basic device embedded in its Space Qualified SRAM Memory Modules.
 Through the successful characterization and qualification of a new 4 Mb SRAM core device, 3D Plus Space Qualified new SRAM Memory Modules are Function - Package - Footprint compatible with the existing modules and they exhibit further enhanced features compared to it.

APPLICATION NOTES

DATA RETENTION OF EEPROM

Data retention results/curve for Hitachi HN58C/V1001 1M EEPROM are based on 3D PLUS test results and are calculated by help of the Arrhenius Rate Law

EEPROM Modules Data Protection at Vcc On/Off

3D Plus EEPROM Modules have been used to save critical data for space missions with years’ flight heritage. This document describes how to use RES pin to prevent unintentional programming to protect the critical data saved in the EEPROM Modules.

MRAM Modules Single Event Upset Immunity

Introducing MRAM Modules Single Event Upset Immunity and test results

How to use 3DMR64M08VS4476 in a space environment

Use of 3DMR64M08VS4476 with 3D PLUS Latch-up Current Limiter Module

DDR2 Modules unused pins

How to handle DDR2 Modules Unused Pins

How to Bypass Obsolescence

3D Plus patented technology allows our customers to replace an obsolete component by a pin-to-pin compatible System-In-Package (SiP) Stack.
 

Programming of parallel EEPROM

Parallel EEPROM programming method is explained with the example of the 8 Mb EEPROM Stack referenced MMEE08001808SCC

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVNESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 16 years of flight heritage and 100 000 modules in Space