Corporate Profile

The technique of interconnection in 3 dimensions of all types of components was set up at Thomson-CSF as of 1989.

Comparing to other existing 2-D traditional solutions, this technology allows gaining a factor of at least 10 on the weight and volume of the components.

At the end of 1995, Pierre Maurice and Christian Val, who designed this technology, bought the initial 3D technology patents and launched 3D Plus Company in order to manufacture cubes based on this principle and patented portfolio.

Strong R&D activities undertaken in collaboration with leading prestigious universities and Key Reference customers, and product and services innovations allow extending and patenting the 3-D technology capability domain and products ranges.

In 1997, 3D Plus set up its High Rel. manufacturing line and its products were endorsed by Major Space Prime Contractors for Space Applications.

In 2000, the first space qualified products from 3D Plus flew in European Space Agency missions.

In 2001, 3D Plus set up a subsidiary in Mc Kinney, Texas, USA.

In 2002, 3D Plus built a new manufacturing plant in Buc, France, for pilot-manufacturing of industrial products.

In 2002, 3D Plus pioneered the Wafer level stacking technology with the development of its WDoD™ process.

In 2003, 3D Plus and 3D Plus USA are certified ISO9001:2000.

In 2008, 3D Plus set up an adaptable and cost-optimized supply chain in Asia. It is sized to achieve a fast time-to-market for the new products, and to meet diverse ramp-up and mass manufacturing requirements of the industrial markets.

In 2009, with more than 30 000 modules in Space, and with more than 9 years of Flight Heritage with no Failure, 3D Plus is recognized as the largest Space qualified catalog products and custom System-In-Packages (SiPs) manufacturer in Europe.

3D Plus is a worldwide supplier of advanced high density 3-D microelectronic products and Die and Wafer Level stacking technologies meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.

Its portfolio of patented and very advanced stacking technologies starts with standard package scale upward to die-size and wafer-level stacking processes, and, provides its products with the capability to embed heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.

3D Plus offers catalog products upward to more complex System-In-Package (SiP) solutions and associated services.

Capital: 1 554 867 €
Shareholding structure: Privately owned
Workforce: 62 employees (60% engineers and technicians, 5 PhD)