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Medical & Sciences

Overview

The fantastic development of the components interconnection technology allowed imagining « Systems in Package » of around a few mm3, which opened new perspectives for medical and sciences applications.

Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.

Key benefits

3D PLUS State-of-the-Art stacking technology and recognized design, manufacturing and test expertise realize key features and benefits for medical and science applications:

• Extreme miniaturization

• Capability to merge heterogeneous component technologies (Die-Package-Passive) and functions (sensor, stimulators, communication, processing, storage, energy) in one single Package

• Very high performance (no parasitic elements between sensors and processing electronics)

• Very High Reliability

• Rugged to harsh environments

Application fields

• Flexible Endoscope and minimally invasive probes (medical and veterinary)

• X-Ray Camera (medical and science)

• Ultrasonic echography

• Leadless pacemakers and implantable cardioverter defibrillator

• Micro stimulators and implantable devices

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVNESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 16 years of flight heritage and 100 000 modules in Space