Medical and Sciences
The fantastic development of the components interconnection technology allowed imagining « Systems in Package » of around a few mm3, which opened new perspectives for medical and sciences applications.
Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.
3D Plus State-of-the-Art stacking technology and recognized design, manufacturing and test expertise realize key features and benefits for medical and science applications:
- Extreme miniaturization
- Capability to merge heterogeneous component technologies (Die-Package-Passive) and functions (sensor, stimulators, communication, processing, storage, energy) in one single Package
- Very high performance (no parasitic elements between sensors and processing electronics)
- Very High Reliability
- Rugged to harsh environments (Autoclave process)
Depending on the application requirements, the relevant stacking process will be selected within 3D Plus technology portfolio. The resulting SiPs are used in various applications fields:
- Endoscopy (medical and veterinary)
- X-Ray Camera (medical and science)
- Ultrasonic echography
- Micro stimulators
- Wearable bio monitoring systems