Avionics and Defense
Leveraging on their reliability, their quality and their high performance under very harsh environments (thermal, vibrations, shocks), 3D Plus standard products and SiPs are ideally suited for Avionics and defense applications.
They realize key features and benefits thanks to the 3D Plus State-of-the-Art stacking technology and recognized design, manufacturing and test expertise:
- Extreme miniaturization
- Capability to merge heterogeneous component technologies (Die-Package-Passive) and functions (sensor, actuators, communication, processing, storage) in one single Package
- Very high performance (no parasitic elements between sensors and processing electronics)
- Very High Reliability
- Rugged to harsh environments (thermal, vibrations, shocks )
The standard products are used in various high performances rugged embedded computers and data storage boards where the capability to enable today the next generation of memory density is Key. It gives also the possibility to choose a preferred basic memory manufacturer for the stacks. 3D Plus adaptable and cost-optimized supply chain is sized to achieve a fast time-to-market for the new products and to meet diverse ramp-up and mass manufacturing requirements.
For the most demanding application, our highly miniaturized and versatile SiPs enable achieving a combination that cannot be realized with monolithic SoC approaches, and it has a lower development cost and a faster time to market.
The main applications fields include:
- Computer boards and Embedded electronics for Flight Control, Navigation, Cockpit displays, Digital map systems,…
- Mission data recorders
- Aircraft camera
- Phase Array radars T/R modules and computer boards
- Localization and movement detection for security forces (firefighters, policemen, soldiers)
- Sensors of all types
- Abandoned sensors’ network