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About

3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.

Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components.

3D PLUS standard products and System-In-Package (SiP) solutions are used in high technology industries for industrial, computer boards & embedded systems, defense & security, aircrafts & avionics, medical & sciences and aerospace applications.

INNOVATION

Inventor of 3D stacked Electronics for Space

QUALITY

High Quality referential with ISO and Space Agencies Certifications

RESPONSIVNESS

Our support teams are everywhere you are to ensure your satisfaction

HIGH RELIABILITY

Rugged components able to withstand harsh environments and space radiation effects

HIGH PERFORMANCE PRODUCTS

Dense, fast, rad hardened, System in Packages, miniaturized

FLIGHT PROVEN

Over 16 years of flight heritage and 100 000 modules in Space